Infineon Technologies Ag

Infineon Technologies Austria Ag

Dorothea Werber

Frank Dieter Pfirsch

Anton Mauder

Carsten Schaeffer

Hans-Joachim Schulze

Volodymyr Komarnitskyy

Thomas Gutt

Franz Hirler

Christian Philipp Sandow

Alexander Philippou

Holger Schulze

Gerhard Miller

Mathias Plappert

A vertical power semiconductor device includes a semiconductor body having opposing first and second main surfaces. At least part of a gate trench structure formed at the first main surface extends along a first lateral direction. Body and source regions directly adjoin the gate trench structure. A drift region is arranged between the body region and second main surface. A body contact structure includes first and second body contact sub-regions spaced at a first lateral distance along the first lateral direction. Each body contact sub-region directly adjoins the gate trench structure and has a larger doping concentration than the body region. In a channel region between the body contact sub-regions, the body contact structure has a second lateral distance to the gate trench structure along a second lateral direction perpendicular to the first lateral direction. The first lateral distance is equal to or less than twice the second lateral distance.

Vertical power semiconductor device and manufacturing method

A reverse-conducting IGBT includes a semiconductor body having a drift region arranged between first and second surfaces. The semiconductor body further includes first collector regions arranged at the second surface and in Ohmic contact with a second electrode, backside emitter regions and in Ohmic contact with the second electrode. In a horizontal direction substantially parallel to the first surface, the first collector regions and backside emitter regions define an rc-IGBT area. The semiconductor body further includes a second collector region of the second conductivity type arranged at the second surface and in Ohmic contact with the second electrode. The second collector region defines in the horizontal direction a pilot-IGBT area. The rc-IGBT area includes first semiconductor regions in Ohmic contact with the first electrode and arranged between the drift region and first electrode. The pilot-IGBT area includes second semiconductor regions of the same conductivity type as the first semiconductor regions.

Reverse-conducting IGBT

According to an embodiment of a method, a semiconductor device is operated in a reverse biased unipolar mode before operating the semiconductor device in an off-state in a forward biased mode. The semiconductor device includes at least one floating parasitic region disposed outside a cell region of the device.

Method of operating a reverse conducting IGBT

A semiconductor device includes a cell region having at least one device cell, wherein the at least one device cell includes a first device region of a first conductivity type. The semiconductor device further includes a drift region of a second conductivity type adjoining the first device region of the at least one device cell, a doped region of the first conductivity type adjoining the drift region, and charge carrier lifetime reduction means configured to reduce a charge carrier lifetime in the doped region of the first conductivity type.

Semiconductor device with charge carrier lifetime reduction means

An electronic circuit includes a reverse-conducting IGBT and a driver circuit. A first diode emitter efficiency of the reverse-conducting IGBT at a first off-state gate voltage differs from a second diode emitter efficiency at a second off-state gate voltage. A driver terminal of the driver circuit is electrically coupled to a gate terminal of the reverse-conducting IGBT. In a first state the driver circuit supplies an on-state gate voltage at the driver terminal. In a second state the driver circuit supplies the first off-state gate voltage, and in a third state the driver circuit supplies the second off-state gate voltage at the driver terminal. The reverse-conducting IGBT may be operated in different modes such that, for example, overall losses may be reduced.

Electronic circuit with a reverse-conducting IGBT and gate driver circuit

A semiconductor device includes at least one field effect transistor structure, which is formed on a semiconductor substrate. The field effect transistor structure includes a drift region, a body region, a source region and a gate. The source region and the drift region include at least mainly a first conductivity type, wherein the body region includes at least mainly a second conductivity type. The body region includes at least one low doping dose portion extending from the drift region to at least one of the source region or an electrical contact interface of the body region at a main surface of the semiconductor substrate, wherein a doping dose within the low doping dose portion of the body region is less than 3 times a breakdown charge.

Semiconductor device

A semiconductor device includes a first doping region extending from a main surface of a semiconductor substrate into the semiconductor substrate. Further, the semiconductor device includes a second doping region arranged adjacent to the first doping region. The first doping region includes at least one low doping dose portion extending from the main surface of the semiconductor substrate to the second doping region. A doping dose within the low doping dose portion of the first doping region is less than 3 times a breakdown charge. Additionally, the semiconductor device includes a first electrode structure in contact with the first doping region at the main surface of the semiconductor substrate. The work function of the first electrode structure at the main surface of the semiconductor substrate is larger than 4.9 eV or lower than 4.4 eV.

Semiconductor devices

A semiconductor device includes a semiconductor body including a drift zone of a first conductivity type, an emitter region of a second, complementary conductivity type configured to inject charge carriers into the drift zone, and an emitter electrode. The emitter electrode includes a metal silicide layer in direct ohmic contact with the emitter region. A net impurity concentration in a portion of the emitter region directly adjoining the metal silicide layer is at most 1&#xd7;10cm.

IGBT with emitter electrode electrically connected with impurity zone

A semiconductor device includes a first emitter region of a first conductivity type, a second emitter region of a second conductivity type complementary to the first type, a drift region of the second conductivity type, and a first electrode. The first and second emitter regions are arranged between the drift region and first electrode and each connected to the first electrode. A device cell of a cell region includes a body region of the first conductivity type adjoining the drift region, a source region of the second conductivity type adjoining the body region, and a gate electrode adjacent the body region and dielectrically insulated from the body region by a gate dielectric. A second electrode is electrically connected to the source and body regions. A parasitic region of the first conductivity type is disposed outside the cell region and includes at least one section with charge carrier lifetime reduction means.

Reverse conducting IGBT

An IGBT includes a semiconductor portion with IGBT cells. Each IGBT cell includes a source zone of a first conductivity type, a body zone of a second, complementary conductivity type, and a drift zone of the first conductivity type separated from the source zone by the body zone. An emitter electrode includes a main layer and an interface layer. The interface layer directly adjoins at least one of the body zone and a supplementary zone of the second conductivity type. A contact resistance between the semiconductor portion and the interface layer is higher than between the semiconductor portion and a material of the main layer. For example, the interface layer may reduce diode emitter efficiency and reverse recovery losses in IGBTs.

IGBT with emitter electrode electrically connected with an impurity zone

A semiconductor device includes a drift zone of a first conductivity type in a semiconductor body. Controllable cells are configured to form a conductive channel connected with the drift zone in a first state. First zones of the first conductivity type as well as second zones and a third zone of a complementary second conductivity type are between the drift zone and a rear side electrode, respectively. The first, second and third zones directly adjoin the rear side electrode. The third zone is larger and has a lower mean emitter efficiency than the second zones.

Semiconductor device and RC-IGBT with zones directly adjoining a rear side electrode

A semiconductor includes a drift zone of a first conductivity type arranged between a first side and a second side of a semiconductor body. The semiconductor device further includes a first region of the first conductivity type and a second region of a second conductivity type subsequently arranged along a first direction parallel to the second side. The semiconductor device further includes an electrode at the second side adjoining the first and second regions. The semiconductor device further includes a third region of the second conductivity type arranged between the drift zone and the first region. The third region is spaced apart from the second region and from the second side.

Reverse conducting insulated gate bipolar transistor

A semiconductor component includes a semiconductor body, a first emitter region of a first conductivity type in the semiconductor body, a second emitter region of a second conductivity type arranged distant to the first emitter region in a vertical direction of the semiconductor body, a base region of one of the first and second conductivity types arranged between the first and second emitter regions and having a lower doping concentration than the first second emitter regions, a first field stop zone of the same conductivity type as the base region arranged in the base region, and a second field stop zone of the same conductivity type as the base region arranged in the base region. The second field stop zone is arranged distant to the first field stop in the vertical direction of the semiconductor, the first field stop zone is arranged between the second field stop zone and the second emitter zone, and the second field stop zone includes a plurality of field stop zone sections arranged mutually distant from each other in at least one horizontal direction of the semiconductor body.

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Munich, Germany

Dorothea Werber