Applied Materials, Inc.

Applied Materials Israel Limited

Doron Shoham

Avishay Guetta

Ron Naftali

Haim Feldman

Ronen Eynat

Gilad Almogy

Gilad Schwartz

Gal Amar

Doron Korngut

Amir Shoham

Oren Reches

Iddo Pinkas

A method and an inspection system that exhibiting speckle reduction characteristics includes a light source arranged to generate input light pulses, and diffuser-free speckle reduction optics that include a beam splitter, for splitting an input light pulse from the light source into multiple light pulses that are oriented at angles in relation to each other when exiting the beam splitter, and at least one optical element for directing the multiple light pulses to impinge on an inspected object at different angles.

Inspection method and an inspection system exhibiting speckle reduction characteristics

Apparatus for generating optical radiation includes a laser, which is configured to operate in multiple transverse modes simultaneously so as to generate an input beam, which is characterized by a first speckle contrast. The transverse modes of the input beam are optically mixed so as to generate an output beam have a second speckle contrast, which is substantially less than the first speckle contrast.

Illumination system for optical inspection

Apparatus for optical inspection of a sample includes a detector assembly, which is configured to receive radiation from a focal area on the sample, and a translation mechanism, which is operative to impart motion to at least one of the detector assembly and the sample so that the focal area of the detector assembly translates over the sample along a translation path. A height sensor is positioned in a known location relative to the detector assembly so as to measure a height of the height sensor relative to a point on the sample that is ahead of the focal area by a predetermined distance along the translation path. A controller is adapted to determine an estimated height of the detector assembly, responsively to the height measured by the height sensor along the translation path.

Method and apparatus for inspecting a sample having a controller for determining an estimated height of the detector from the sample

An optical system for detecting defects on a wafer that includes a device for producing a beam and directing the beam onto the wafer surface, producing an illuminated spot on the wafer's surface. The system further includes a detector detecting light, and a mirrored assembly having together with the detector an axis of symmetry about a line perpendicular to the wafer surface. The assembly is configured to receive scattered light from the surface, where the scattered light including a first scattered light part being scattered from the pattern. The assembly is further configured to reflect and focus rotationally symmetrically about the axis of symmetry the scattered light to the detector. The system further includes a device operating with the detector for facilitating detection of a scattered light other than the specified scattered light due to pattern.

Process and assembly for non-destructive surface inspection

An imaging system for inspection of a sample includes an illumination module, which irradiates a surface of the sample with pulsed optical radiation. A mechanical scanner translates at least one of the sample and part of the imaging system so as to scan an area irradiated by the pulsed optical radiation over the surface in order to irradiate successive, partially overlapping frames on the surface by respective successive pulses of the pulsed radiation. A collection module collects the optical radiation scattered from the surface so as to capture a sequence of images of the irradiated frames. A system controller varies a configuration of the imaging system in alternation between at least first and second different optical configurations in synchronization with the pulsed optical radiation.

Optical inspection with alternating configurations

Method and apparatus for inspecting a sample having a height measurement ahead of a focal area

A method of inspecting a plurality of wafers in an optical inspection tool. The method includes the steps of generating a reference wafer and polishing the reference wafer in a chemical mechanical polishing process following a metal deposition process such that the reference wafer is representative of a fully polished wafer. The optical inspection tool scans the reference wafer and a gray level map is generated. A number of further wafers are metalized, polished, scanned and gray level maps generated. The method includes the step of comparing a gray level map of the scanned reference wafer to a number of gray level maps of the scanned wafers. A determination () is then made as to whether the wafer exhibits an acceptable polishing quality based on the comparison.

Wafer inspection methods and an optical inspection tool

A system and method for inspection of a substrate having a first refractive index, the method including the steps of: (i) defining an apodization scheme in response to a characteristic of the layer; (ii) applying an apodizer to apodize a beam of radiation in response to the apodization scheme; (iii) directing the apodized beam of radiation to impinge on the substrate, whereby a plurality of rays are reflected from the substrate; whereas the apodized beam of radiation propagates through an at least partially transparent medium having a third refractive index and an at least partially transparent layer having a second refractive index and is subsequently reflected from the substrate; whereas the second refractive index differs from the first refractive index and from the third refractive index; and (iv) detecting at least some of the plurality of reflected rays.

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Rehovot, Israel

Doron Shoham