Applied Materials Israel Limited

Shilat Optronics Ltd.

Shilat Optical Systems Ltd.

Other

Applied Materials, Inc.

Doron Korngut

Avishay Guetta

Michael Yagudaev

Ron Naftali

Haim Feldman

Yoram Uziel

Ido Almog

Gil Blai

Ron Bar-or

Yuval Gronau

Doron Shoham

Ofer Adan

Ori Golani

Yuri Belenky

Yoni Cohen

Harel Ilan

Ronen Eynat

Ofer Shneyour

Benjamin Cohen

Iddo Pinkas

Erez Admoni

Ofer Kadar

Lev Haikoviz

Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives, and (ii) analyzing scan data of a last scanned page while scanning a next page from the plurality of pages. At least some of the pages include multiple slices of the wafer. The analysis of the scan data includes identifying defects in the scanned pages, based on an integrated analysis combining scan data from each of the multiplicity of perspectives. Further disclosed is a computerized system configured to implement the method.

Methods and systems for expediting multi-perspective wafer analysis

Disclosed herein is a computerized system including scanning equipment configured to obtain multi-perspective scan data of a slice on a sample. The scanning equipment includes: (i) a light source configured to generate a light beam; (ii) an acousto-optic deflector (AOD) configured to focus the light beam such as to generate a beam train scanned along consecutive lines on the slice, in groups of n&#x2265;2 successively scanned lines, along each of which the beam train forms at least one illumination spot, respectively; and (iii) one or more detectors configured to sense light returned from the slice. The n&#x2265;2 lines are scanned different perspectives, respectively. The consecutive lines may be longitudinally displaced relative to one another, such as to overlap in 100&#xb7;(n&#x2212;1)/n % of widths thereof, so that the slice may be fully scanned in each of the perspectives.

Multi-perspective wafer analysis using an acousto-optic deflector

According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.

Chuck for supporting a wafer

A laser designator system using modulated CW laser diodes and a conventional high pixel count image sensor array, such as CCD or CMOS array. These two technologies, diode lasers and imaging sensor arrays are reliable, widely used and inexpensive technologies, as compared with prior art pulsed laser systems. These systems are distinguished from the prior art systems in that they filter the laser signal spatially, by collecting light over a comparatively long period of time from a very few pixels out of the entire field of view of the image sensor array. This is in contrast to the prior art systems where the laser signal is filtered temporarily, over a very short time span, but over a large fraction of the field of view. By spatially filtering the signal outputs of the individual pixels, it becomes possible to subtract the background illumination from the illuminated laser spot.

Laser daylight designation and pointing

There may be provided an evaluation system that may include spatial sensors that include atomic force microscopes (AFMs) and a solid immersion lens. The AFMs are arranged to generate spatial relationship information that is indicative of a spatial relationship between the solid immersion lens and a substrate. The controller is arranged to receive the spatial relationship information and to send correction signals to the at least one location correction element for introducing a desired spatial relationship between the solid immersion lens and the substrate.

Evaluation system and a method for evaluating a substrate

A system for the surveillance of terrain and the detection of intrusions over a plane extending into that terrain. A curtain array of light beams is projected along the plane and reflections from the terrain are detected by a sensor array essentially spatially coincident with the array of light sources. The times of flight of the beams are determined, and these characterize the form of the terrain being surveilled. The initial background reflection pattern is acquired and stored by the system. A sudden change in this detected background pattern can be defined as arising from an unexpected reflection, indicative of an intrusion. Signal processing systems are described utilizing modulated laser beams and detection at a frequency at least twice that of the modulation, such that reflected signals arising from the ON and the OFF periods of the laser modulation can be subtracted to eliminate the background signals.

Terrain surveillance system

A system for detecting intrusion across a surface, comprising a plurality of light sources projecting an array of illuminating beams along different optical paths in the surface and a detector array system directed such that it detects along a plurality of fields of view in the surface, illumination reflected from the illuminating beams. A signal processing system detects changes along the array of fields of view, in the reflected illumination level detected by the detector system. An increase greater than a predefined level in the reflected illumination level from any field of view provides an indication of an intrusion across the surveilled surface along that field of view, at the crossing point of the direction of that field of view with the optical path whose illuminating beam generated the increase in reflected illumination from that field of view.

Intrusion warning system

Apparatus for inspecting a surface of a sample, including a detector and folding optics. The folding optics are configured to receive radiation arising from a first region of the surface and from a second region of the surface. The first region and the second region have a first spatial relationship with respect to each other. The folding optics form from the radiation a first image of the first region and a second image of the second region on the detector, wherein the first image is a linear transformation of the first region and the second image is the linear transformation of the second region. The first image and the second image have a second spatial relationship, different from the linear transformation of the first spatial relationship, with respect to each other.

Field folding optical method for imaging system

Apparatus for reducing speckle, including a first coherence-reducing component, having a first array of transparent first elements arranged to receive different, respective first portions of a collimated light beam that is incident on the first component, the first elements generating different, respective optical lengths with respect to the light beam passing therethrough and outputting the respective first portions as respective first collimated sub-beams. The apparatus further includes a second coherence-reducing component, having a second array of transparent second elements arranged to receive different, respective second portions of each of the first collimated sub-beams of the light beam, the second elements generating different, respective optical lengths with respect to the light beam passing therethrough and outputting the respective second portions as respective second collimated sub-beams. The apparatus also includes a light combiner, which is arranged to combine the second collimated sub-beams into a collimated output beam.

Speckle reduction with transparent blocks

An imaging system for inspection of a sample includes an illumination module, which irradiates a surface of the sample with pulsed optical radiation. A mechanical scanner translates at least one of the sample and part of the imaging system so as to scan an area irradiated by the pulsed optical radiation over the surface in order to irradiate successive, partially overlapping frames on the surface by respective successive pulses of the pulsed radiation. A collection module collects the optical radiation scattered from the surface so as to capture a sequence of images of the irradiated frames. A system controller varies a configuration of the imaging system in alternation between at least first and second different optical configurations in synchronization with the pulsed optical radiation.

Optical inspection with alternating configurations

Apparatus for inspection of a sample includes a radiation source, which is adapted to direct optical radiation onto an area of a surface of the sample, and a plurality of image sensors. Each of the image sensors is configured to receive the radiation scattered from the area into a different, respective angular range, so as to form respective images of the area. An image processor is adapted to process at least one of the respective images so as to detect a defect on the surface.

Dark field inspection system

Apparatus for imaging an area of a surface along a viewing angle that is oblique to the surface includes an afocal optical relay, which is adapted to form a tilted initial image of the area by collecting optical radiation from the area along an optical axis oriented at the viewing angle. A tilt correction unit is coupled to correct a tilt of the initial image so as to form a substantially undistorted intermediate image. A magnification module is coupled to focus the intermediate image onto an image detector.

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Modiin, Israel

Doron Korngut