Robert Boschgmbh

Paragon Ag

Doris Schielein

Christoph Schelling

Heribert Weber

Frank Fischer

Christian Krummel

Dirk Bueche

Branko Banjac

A chemical sensor has a substrate, a first metallization plane on the substrate, an electrode structure formed in the first metallization plane, a passivation layer applied to the first metallization plane and formed with contact holes, a sensitive ceramic layer on the passivation layer and in the contact holes, and a bond-promoting layer configured as a second metallization plane and between the passivation layer and the ceramic layer.

Microstructured chemical sensor

A method of micromechanically manufacturing fixed and movable layer-like electrodes of a semiconductor element, for example, a capacitive acceleration sensor, which are exposed over a substrate over a certain area is provided. A sacrificial layer may be arranged between the substrate and the fixed and movable electrodes being removed in an etching step in order to expose the electrodes with respect to the substrate. The thickness of the sacrificial layer located in the area of the fixed electrodes may be less than the thickness of the sacrificial layer located in the area of the movable electrodes.

Method of micromechanical manufacturing of a semiconductor element, in particular an acceleration sensor

Growing community of inventors

Gomaringen, Germany

Doris Schielein