Osram Oled Gmbh

Doreen Heppner

Erwin Lang

Tilman Schlenker

Richard Baisl

Benjamin Krummacher

Michael Popp

Thomas Dobbertin

Dirk Becker

Christian Schmid

Evelyn Trummer-Sailer

An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

Encapsulation for an organic electronic device

An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.

Encapsulation structure for an opto-electronic component

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Koefering, Germany

Doreen Heppner