Dow Corning Corporation

Dow Silicones Corporation

Dow Global Technolgoies LLC

Dow Corning Toray Company, Ltd.

Dow Global Technologies LLC (dgtl)

Dow Corning Korea Ltd.

Dorab Edul Bhagwagar

Yan Zheng

Peng Wei

Qianqing Ge

Lei Huang

Hongyu Chen

Michael A Lutz

William James Schulz, Jr

Don Lee Kleyer

Kai Su

Zhanjie Li

Jiguang Zhang

Jing Jiang

Elizabeth Wood

Kelly Messing

Donald Taylor Liles

Chao He

Dongchan Ahn

Kimmai Thi Nguyen

Zuchen Lin

Nick Evan Shephard

Toyohiko Fujisawa

Loren D Durfee

Timothy Paul Mitchell

Kent R Larson

Kouichi Ozaki

Manabu Sutoh

Junmin Zhu

Toru Imaizumi

Xiaolian Hu

Shengqing Xu

Fengyi Su

Adriana Petkova Zambova

Andrew Anthony Mojica

Debo Hong

Darren Hansen

Xuedong Gao

David Ha

G M Fazley Elahee

Danhuan Ma

Sarah Nicol

Jeffrey Krzywosinski

Cassie Hale

Cameron J Kadleck

Kelly J Messing

Hanguang Wu

Daesup Hyun

Andrew Mojica

Jeffrey Stolarczyk

Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cure

A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one poly-organosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-150 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles; (ii) 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles; (iii) 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-5 micrometers; and (iv) 10-15 weight-percent thermally conductive filler particles having an average particle size in a range of 0.1 to 0.5 micrometers; where weight-percent is relative to composition weight.

Highly thermally conductive flowable silicone composition

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

Thermally conductive composition and methods and devices in which said composition is used

A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.

Non-curable thermally conductive pituitous silicone material

A composition contains an organopolysiloxane having the average chemical structure (I):[R'RSiO&#x2014;(RSiO)]&#x2014;Si&#x2014;[OSiR]&#x2014;Y&#x2014;Si(OR)&#x2003;&#x2003;(I)where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R&#x2032; is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X&#x2014;(RSiO)SiR&#x2014;X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.

Trialkoxy functional branched siloxane compositions

A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component.

Method for applying thermally conductive composition on electronic components

Metal-polyorganosiloxane materials, methods of making and using them, and manufactured articles and devices containing them are disclosed. The metal-polyorganosiloxane materials have improved thermal stability and comprises a metal-polyorganosiloxane mixture that is free of condensation-curable polyorganosiloxane and solid particles other than metal particles and ceramic particles, the metal-organosiloxane mixture otherwise comprising: (A) a polyorganosiloxane that is free of silicon-bonded organoheteryl groups; (B) a hydrocarbylene-based multipodal silane; and (C) metal particles.

Metal-polyorganosiloxanes

A curable composition comprises (A) a polyfunctional acrylate; (B) a fluoro-substituted compound having an aliphatic unsaturated bond; (C) an organopolysiloxane having at least one acrylate group; and (D) a reinforcing filler. A cured product formed by curing the curable composition is also disclosed. A method of forming the cured product comprises applying the curable composition on a substrate. The method further comprises curing the curable composition on the substrate so as to form the cured product on the substrate.

Curable composition, cured product formed from the curable composition, and method of forming the cured product

Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.

High temperature stable thermally conductive materials

A fluorinated compound having at least one (meth)acrylate functional group disclosed. A curable composition comprising the fluorinated compound and polyfunctional acrylate, a cured product formed from the curable composition, and method of forming the cured product are also disclosed.

Fluorinated compound, curable composition comprising same, and cured product

A composition comprises (A) a condensation reaction catalyst, (B) a polyorganosiloxane having an average, per molecule, of at least two hydrolyzable substituents, (C) a crosslinker, and (D) a thermally conductive filler. The polyorganosiloxane may be silanol terminated, and the crosslinker may be an alkoxysilylhydrocarbylene functional polyorganosiloxane. The composition is capable of reacting via condensation reaction to form a thermally conductive product. The composition and product are useful for thermal management in (opto)electronics applications.

Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition

The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.

Microparticles and curable organopolysiloxane composition containing the same

A thermally conductive grease includes 2 vol % to 15 vol % of a combination of three polyorganosiloxanes and 65 vol % to 98 vol % of a thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from (opto)electronic devices, in both TIMand TIMapplications.

Thermally conductive grease and methods and devices in which said grease is used

A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIMand TIMapplications in electronic devices.

Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use

Growing community of inventors

Saginaw, MI, United States of America

Dorab Edul Bhagwagar