Samsung Electronics Co., Ltd.

Dooseok Choi

Youngki Lee

Sunwoo Lee

Thomas Byunghak Cho

Seungchan Heo

Youngmin Kim

Seung-chan Heo

Hongjong Park

Daeyoung Yoon

Sun Woo Lee

Young Min Kim

Young Ki Lee

YoungMin Kim

Sun-woo Lee

Joonhoi Hur

Jei Young Lee

Dae-young Yoon

Minyoung Yoon

Dae Young Yoon

Provided is an antenna array structure including a plurality of first antenna elements for transmitting and receiving a signal at a first frequency and a plurality of second antenna elements for transmitting and receiving a signal at a second frequency, wherein the plurality of first antenna elements are disposed in a first layer and aligned to a line extending in a first direction and the plurality of second antenna elements are disposed in a second layer and aligned to the line.

Antenna array structure including stacked and interleaved antenna elements and method of arranging the same

Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.

Wideband antenna and antenna module including the same

A wireless communications device may include a controller configured to, in a calibration mode, obtain a first output value of a first power detector after setting a first power amplifier to a first gain and obtain a second output value of the first power detector after setting the first power amplifier to a second gain, wherein the controller may estimate, in a normal mode, output power of a first antenna from an output value of the first power detector, based on a correction coefficient calculated using the first output value and the second output value.

Device and method of estimating output power of array antenna

An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

Transceiver using active device array and antenna module including the same

An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.

Multi-band antenna device

A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.

Antenna module and radio frequency apparatus including the same

An antenna device includes a first antenna, a second antenna, a barrier, and a signal processing device. The first antenna transceives a first radio frequency (RF) signal in a first communication band, and the second antenna transceives a second RF signal in a second communication band. The first antenna includes a first radiator and a second radiator having a shape symmetrical to a shape of the first radiator. The second antenna includes third and fourth radiators having shape identical to those of the first and second radiators but having a size corresponding to the second communication band. The barrier includes a penetration region, and reflects the first and second RF signals. A center frequency of the second communication band is higher than a center frequency of the first communication band, and the first and second antennas are connected with the signal processing device through the penetration region of the barrier.

An antenna includes a first dielectric substrate and a first feeding element. The first dielectric substrate includes a first insulating layer, and a first radiation plate including a first opening that exposes an upper surface of the first insulating layer. The first feeding element is disposed in the first opening to penetrate the first insulating layer in a direction extending toward a lower surface of the first dielectric substrate. The first feeding element is insulated from the first radiation plate by the first insulating layer. The first feeding element includes a first conductive plate having an upper surface located on a same plane as an upper surface of the first radiation plate.

Dual-band antenna using coupled feeding and electronic device comprising the same

A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.

Multi-fed patch antennas and devices including the same

An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.

An electronic device including: a modem configured to process a baseband signal; an intermediate frequency (IF) transceiver configured to convert the baseband signal provided from the modem into an IF band signal; and a radio frequency (RF) transceiver configured to convert the IF band signal provided from the IF transceiver into an RF band signal, wherein the RF transceiver includes a power amplifier configured to amplify the RF band signal, and a temperature sensor unit to detect a temperature of the power amplifier, and wherein the modem includes a controller configured to control an input power inputted to the RF transceiver based on the temperature of the power amplifier detected by the temperature sensor unit.

Electronic device including a temperature sensor connected to a power amplifier and a controller to control an input power based on a temperature of the power amplifier detected by the temperature sensor

A method of testing a radio frequency (RF) integrated circuit includes: forming, performed by the RF integrated circuit, a test loop that passes through a first transceiver circuit, a first front-end circuit, and a second transceiver circuit, based on a test control signal transmitted from a test device; adjusting, performed by the RF integrated circuit, a shift degree of at least one phase shifter in the first front-end circuit, based on the test control circuit; and receiving, performed by the RF integrated circuit, a test input signal via the first transceiver circuit from the test device, and outputting, to the test device, the test input signal that has passed through the test loop, wherein the test input signal is output as a test output signal via the second transceiver circuit.

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Hwaseong-si, South Korea

Dooseok Choi