Samsung Sdi Co., Inc.

Doori Song

Jiho Lee

Dongju Shin

Woo Han Kim

Hong Jeong Yu

Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises: (A) an epoxy group-containing siloxane compound represented by Chemical Formula 1:(RRRSiO)(RRSiO)(RSiO)(RRSiO)(RSiO)&#x2003;&#x2003;[Chemical Formula 1](In Chemical Formula 1, each of Rto Ris an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0&#x2264;M&#x3c;1, 0&#x2264;D1&#x3c;1, 0&#x3c;T&#x2264;1, 0&#x2264;D2&#x3c;1, 0&#x2264;T2&#x3c;1, and M+D1+T1+D2+T2=1, wherein each of the structural units represented by M, D1, T1, D2, and T2 can include one or more types of different structural units); and (B) a cationic thermal initiator for a ring-opening reaction of epoxide, the initiator being a salt of a sulfonium-based cation and a borate-based anion, wherein the compound represented by chemical formula 1 is a combination of a siloxane 1,000 and a siloxane compound of which a number average molecular weight is in a range of 1,000-10,000.

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Suwon-si, South Korea

Doori Song