Samsung Electronics Co., Ltd.

Doojin Kim

Youngsik Kim

Sungbok Hong

Kitaik Oh

Yongmin Kim

Hyungjin Lee

Seokho Lee

Chulmin Kim

Yongdae Ha

Kunho Song

Younggon Hwang

A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.

Method for replacing capillary

A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.

Chuck table and substrate processing system including the same

A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.

Semiconductor packages and methods of manufacturing the same

A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Magazine for loading a lead frame

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Chungcheongnam-do, South Korea

Doojin Kim