Samsung Electronics Co., Ltd.

Doogon Kim

Jinman Han

Hansoo Kim

Sunil Shim

Changhyun Lee

Jaehoon Jang

Sunghoi Hur

Wonseok Cho

Jaehun Jeong

Jongin Yun

Kitae Park

Jintae Kim

Donghyuk Chae

Moosung Kim

Cheon An Lee

Ho-Chul Lee

Su-Yong Kim

Tae-hong Kwon

A nonvolatile memory device includes a memory cell array, an address decoder, an input/output circuit, a CSL driver, and control logic. The memory cell array includes a plurality of memory blocks each having a plurality of strings that are formed in a direction perpendicular to a substrate and are connected between bit lines and a common source line. The CSL driver sets up the common source line with a predetermined voltage and supplies or drains charge to or from the common source line using a voltage level of the common source line as a feedback signal.

Nonvolatile memory device and programming method thereof including common source line feedback during program and verification operation

Provided is a programming method of a nonvolatile memory device. The nonvolatile memory device includes a substrate and a plurality of memory cells which are stacked in the direction perpendicular to the substrate. The programming method applies a first voltage to a selected bit line connected to at least two memory strings in same column including a memory cell of the plurality of memory cell to be programmed, applies a second voltage to an unselected bit line connected to at least two memory strings in same column including a memory cell of the plurality of memory cell to be program-prohibited, applies a third voltage to a selected string selection line connected to at least two memory strings in same row, applies a fourth voltage to an unselected string selection line connected to at least two memory strings in same row, and applies a program operation voltage to a plurality of word lines, each word line connected to each corresponding memory cell in the memory string, wherein the first to third voltages are positive voltages.

Nonvolatile memory device, programming method thereof and memory system including the same

Nonvolatile memory devices including memory cell arrays with first bit line regions and common source tapping regions which are alternately disposed on a substrate along a direction, a page buffer including second bit line regions aligned with the first bit line regions and page buffer tapping regions aligned with the common source tapping regions, and a plurality of bit lines spaced apart from one another and extending to the second bit line regions from the first bit line regions.

Nonvolatile memory devices

Provided is an erasing method of a nonvolatile memory device. The erasing method applies a word line erase voltage to a plurality of word lines connected to the memory cells respectively, applies a specific voltage to a ground selection line connected to the ground selection transistor, applies an erase voltage to a substrate in which the memory string formed during the step applying the specific voltage to the ground selection line, and floats the ground selection line in response to a voltage change of the substrate.

Nonvolatile memory device, erasing method thereof, and memory system including the same

Provided is a method of operating a non-volatile memory device. The method includes applying a turn-on voltage to each of first and second string select transistors of a first NAND string, applying first and second voltages to third and fourth string select transistors of a second NAND string, respectively, and applying a high voltage to word lines connected with memory cells of the first and second NAND strings.

Non-volatile memory device having vertical structure and method of operating the same

A nonvolatile memory device configured to apply a wordline erase voltage to a plurality of wordlines connected to a plurality of memory cells, apply an erase voltage to a substrate where a memory cell string is formed while applying a specific voltage to at least one ground selection line connected to at least one ground selection transistor, and float the at least one ground selection line when a target voltage of the substrate reaches a target voltage.

Nonvolatile memory devices, memory systems and computing systems

A high voltage generating circuit includes first and second high voltage pump circuits and an oscillator. The oscillator is configured to output a first clock signal driving the first high voltage pump circuit and a second clock signal driving the second high voltage pump circuit. The oscillator includes a first delay circuit configured to output the second clock signal by delaying the first clock signal by a first delay time. The first delay circuit is configured to adjust the first delay time according to a period of the first clock signal.

High voltage generating circuit and method of operating the same

A nonvolatile memory device comprises a memory cell array comprising a plurality of memory blocks, an address decoder that selects one of the memory blocks in response to an input address and generates a first control signal and a second control signal, a plurality of metal lines connected with the memory blocks and extending along a first direction, a plurality of pass transistors that connect the address decoder with a first subset of the metal lines connected with the selected memory block in response to the first control signal, and a plurality of ground transistors that supply a low voltage to a second subset of the metal lines connected with unselected memory blocks in response to the second control signal. The ground transistors have channels that extend along a second direction perpendicular to the first direction.

Nonvolatile memory device having stacked transistor configuration

Non-volatile memory device, erasing method thereof, and memory system including the same

A three-dimensional semiconductor device includes stacked structures arranged two-dimensionally on a substrate, a first interconnection layer including first interconnections and disposed on the stacked structures, and a second interconnection layer including second interconnections and disposed on the first interconnection layer. Each of the stacked structures has a lower region including a plurality of stacked lower word lines, and an upper region including a plurality of stacked upper word lines disposed on the stack of lower word lines. Each of the first interconnections is connected to one of the lower word lines and each of the second interconnections is connected to one of the upper word lines.

Interconnection structure of three-dimensional semiconductor device

In one embodiment, an erase method for a memory including a memory array having at least first and second programmable transistors connected in series, includes restricting flow of electrons from the first programmable transistor into the second programmable transistor during an erase operation.

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Hwaseong-si, South Korea

Doogon Kim