Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Sungkyunkwan University

Doo Young Kim

Jae Yeol Choi

Chang Hoon Kim

Byoung Hwa Lee

Jong Ho Lee

Wi Heon Kim

Young Ghyu Ahn

Seok Hyun Yoon

Dong Ik Chang

Sang Soo Park

Min Cheol Park

Kang Heon Hur

Hai Joon Lee

Chung Eun Lee

Hyo Jung Kim

Ji Hun Jeong

Youn Sik Jin

Sung Woo Kim

Jae Sung Park

Sang Huk Kim

Eun Hyuk Chae

Chul Seung Lee

Jong Bong Lim

Yu Na Kim

Hae Sock Chung

Sang Hyun Park

Myung Jun Park

Jin Man Jung

Eung Soo Kim

Jin Hyung Lim

Min Hee Hong

Na Rim Ha

Jong Han Kim

Chang Hak Choi

Jeong Ryeol Kim

Kyung Seop Ahn

Hyun Tae Kim

Hye Young Choi

Hang Kyu Cho

Hyeong Kyu Lee

Ji Young Park

Eun Sang Na

Jin Seong Kim

Kyung Nam Hwang

Heung Kil Park

Ki Hwan Kim

Tae Young Kim

Ki Pyo Hong

Dong Won Kim

Dong Hoon Kim

Yong Suk Kim

Ju Hwan Yang

Hyun Hee Gu

Young Tae Kim

Taek Jung Lee

Hae Suk Chung

Jin Kyung Joo

Yun Sung Kang

Sung Hyung Kang

Seok Kyoon Woo

Sang Hoon Kwon

Hyoung Uk Kim

Du Won Choi

Bo Young Park

Chan Hee Nam

Byeong Gyu Park

Yun Jung Park

Kum Jin Park

Kyung Ryul Lee

Byung Soo Kim

Jong Hoon Yoo

Hong Seok Kim

Min Gi Sin

Soo Kyong Jo

Ji Hee Moon

Bum Suk Kang

Hyo Sub Kim

Dong Hwan Seo

Sung Bum Sohn

Young Sook Lee

Sun Hwa Kim

Byung Woo Jeon

Kyoung Jin Jun

Chi Hwa Lee

Hoe Chul Jung

Seok Il Hong

Joong Ku Lee

Kyu Sik Park

Ok Kyoung Kwon

Yongnam Lee

Duk Hyun Chun

Won Jun Na

Kyoung No Lee

Ik Hwan Chang

Kyu Ree Kim

Su Hwan Cho

Gui Hua Quan

Byung Woo Han

Hyun Woo Kim

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body. A ceramic layer is disposed between the dielectric layer and the internal electrode. When an area ratio occupied by pores with respect to the ceramic layer is Sp1 and an area ratio occupied by pores with respect to the dielectric layer is Sp2, Sp1 is less than 5%, and Sp1<Sp2 is satisfied.

Multilayer electronic component and method of manufacturing multilayer electronic component

A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half.

Multilayer ceramic capacitor and board having the same

A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately stacked. The dielectric layers contain at least one dielectric grain having a ratio of a long axis to a short axis that is 3.5 or more. The internal electrodes contain a ceramic component containing a grain growth adjusting ingredient for dielectric grains. Each dielectric layer includes interfacial portions adjacent to the internal electrodes and a central portion disposed between the interfacial portions, and concentrations of the grain growth adjusting ingredient in the interfacial portions and the central portion are different from each other.

Multilayer ceramic electronic component

An insulator composition includes AlOhaving a particle size of 120 to 500 nm. The insulator composition has a strength of 400 to 740 MPa and a particle size of 1 &#x3bc;m or less.

Insulator composition and manufacturing method using the same

A multilayer ceramic capacitor includes: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively, wherein the body includes first dummy patterns formed adjacent to the first internal electrodes in a width direction to be spaced apart from the first internal electrodes, and the first dummy patterns are stacked to partially overlap the second internal electrodes.

Multilayer ceramic capacitor and method of manufacturing the same

A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.

Multilayer ceramic electronic component including ceramic-metal compound layers

A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.

Method of manufacturing multilayer ceramic electronic component

A multilayer ceramic capacitor includes: a ceramic body having dielectric layers laminated in a thickness direction, the dielectric layers having a greater width than a length; an active layer in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body opposite to each other in a length direction with the dielectric layer interposed therebetween; upper cover layer; lower cover layers being thicker than the upper cover layer; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower cover layer is denoted by B, half of thickness of the active layer is denoted by C, and thickness of the upper cover layer is denoted by D, 1.042&#x2264;(B+C)/A&#x2264;1.537 is satisfied.

Multilayer ceramic capacitor and mounting board therefor

Disclosed herein is a thin film type capacitor element, including: a body part formed by stacking a plurality of dielectric layers; a first internal electrode provided in the body part and including a first non-plated region; a second internal electrode including a second non-plated region; a first via formed in the first non-plated region; and a second via formed in the second non-plated region.

Thin film type capacitor element and method of manufacturing the same

A dielectric material includes a barium titanate based base material main ingredient and an accessory ingredient. In a fine sintered structure of the dielectric material, crystal grains in which a content of Ca is less than 2.5 mol % are first crystal grains, crystal grains in which the content of Ca is 4.0 to 12.0 mol % are second crystal grains, and a ratio of an average size of the first crystal grains to an average size of the second crystal grains is in a range of 1.6 to 2.2.

Dielectric ceramic composition, dielectric material, and multilayer ceramic capacitor containing the same

A multilayer ceramic electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; with external electrodes disposed on the capacitor body and electrically connected to the internal electrodes, wherein the capacitor body includes an active region in which internal electrodes having different polarities from each other overlap each other to form capacitance, and a margin part defined as region except for the active region. A concentration of an additive element in the margin part is higher than the concentration of the additive element in the active region, and the margin part has a concentration gradient of the additive element from a surface of the capacitor body toward the active region.

Multilayer ceramic electronic component and manufacturing method thereof

A coil component includes: a coil part including a first coil layer and a second coil layer disposed above the first coil layer, wherein the first coil layer includes a first insulating layer having a first opening pattern and a first conductive layer disposed in the first opening pattern, and the second coil layer includes a second insulating layer having a second opening pattern, a seed layer covering inner side surfaces and a lower surface of the second opening pattern, and a second conductive layer disposed in the second opening pattern.

Coil component and method of manufacturing the same

A dielectric composition and a multilayer ceramic capacitor containing the same are provided. The dielectric composition contains an oxide of Ba and Ti as a main ingredient, and the main ingredient is represented by (Ba(Na, Ca))TiO, where 0.005&#x2266;x&#x2266;0.035 and 0.994&#x3c;(Ba(Na, Ca))/Ti&#x3c;1.003.

Dielectric composition and multilayer ceramic capacitor containing the same

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Gyunggi-do, South Korea

Doo Young Kim