Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Doo Soub Shin

Tae Yong Lee

Kyoung Yeon Lee

Sung Gyu Kim

Ji Yeon Ryu

Jin Young Khim

Seon A Lee

Woo Bin Jung

A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Semiconductor package with EMI shield and fabricating method thereof

A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.

Semiconductor devices and methods of manufacturing semiconductor devices

Growing community of inventors

Incheon, South Korea

Doo Soub Shin