Samsung Display Co., Ltd.

Other

Doo San Park

Hyun Chul Jin

Myong-Soo Oh

Myong Soo Oh

Hee Jong Shin

Seong Ho Choi

A bonding apparatus includes: an anisotropic conductive film ('ACF') attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.

Bonding apparatus and bonding method

A display device includes: a display panel including a display area and a non-display area; a flexible printed circuit board overlapping and attached to the display panel; a pair of first alignment indicia disposed in the non-display area; a pair of second alignment indicia adjacent to the first alignment indicia; a pair of third alignment indicia disposed on the flexible printed circuit board.

Display device and method of manufacturing the same

A plush toy, comprising a costume which is a sculptural representation of a first item is disclosed. The costume comprises a hollow base portion, a head portion attached to the hollow base portion and a snout portion attached to the head portion. A second sculptural element which may be a human figure is adapted to fit into hollows defined by the costume. Finally, a pillow is attached to the costume between the hollow head portion and the hollow base portion and is freely movable to fill either hollow.

Growing community of inventors

Asan-si, South Korea

Doo San Park