Samsung Electro-mechanics Co., Ltd.

Doo Ho Yoo

Jung Il Kim

Jung Hak Nam

Young Key Kim

Jong Pil Lee

Hyung Gon Kim

Hyun Jun Choi

Hyung Seok Roh

Jin Hwan Kim

Ichiro Tanaka

Young Jong Yoo

Nam Kyu Lee

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Electronic component and manufacturing method thereof

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Chip resistor and chip resistor assembly

A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

Chip resistance element and chip resistance element assembly

There is provided a driving circuit of a light emitting device. The driving circuit of a light emitting may include: a DC/DC converter converting an input DC voltage into an output DC voltage; a light emitting device block including a plurality of LED groups connected to an output terminal of the DC/DC converter; a current source circuit unit including a plurality of current sources; a voltage detection unit detecting the output DC voltage of the DC/DC converter; a minimum voltage detection unit detecting a minimum voltage among a plurality of voltages between the plurality of LED groups and the plurality of current sources, respectively; and a single comparator including a first non-inverting input terminal receiving the voltage detected by the voltage detection unit, a second non-inverting input terminal receiving the minimum voltage detected by the minimum voltage detection unit, and an inverting input terminal receiving a predetermined reference voltage.

Growing community of inventors

Suwon-si, South Korea

Doo Ho Yoo