International Business Machines Corporation

Donna S Zupanski-Nielson

Chih-Chao Yang

Lawrence Alfred Clevenger

Carl John Radens

Mukta G Farooq

Louis Lu-Chen Hsu

William Francis Landers

An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.

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Yorktown Heights, NY, United States of America

Donna S Zupanski-Nielson