Macdermid, Incorporated

Macdermid Acumen, Inc.

Donna Kologe

Gary B Larson

Jon E Bengston

Donald R Ferrier

Ernest Long

Colleen Mckirryher

Carl P Steinecker

Lenora M Toscano

Cynthia Retallick

Witold Paw

Paul Romaine

Katsutsugu Koyasu

This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the soldermask surfaces.

Composition and method for selective plating

The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce these circuit boards.

Method for the manufacture of printed circuit boards

Disclosed is a composition and process useful in activating nickel-phosphorous surfaces for subsequent plating thereon. A combination of sulfuric acid and ammonium sulfate is utilized to render otherwise non-catalytic nickel-phosphorous surfaces catalytic to subsequent plating.

Process for the activation of nickel - phosphorous surfaces

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Thomaston, CT, United States of America

Donna Kologe