Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Dongzhao Li

Jingpeng Li

Haiyun Lin

Qinghui Zhao

Jian Li

Tingze Dong

Nannan Du

A color film substrate, a method for manufacturing the same, and a display device are provided, and relate to the field of display technology. The method includes providing a basal substrate, a surface of the basal substrate including a plurality of separated color filter regions and a plurality of interval regions, each interval region being located between two adjacent color filter regions, forming a color filter pattern in each color filter region, and forming a transparent filling pattern in each interval region, and performing a blackening process to the filling pattern so that the filling pattern is converted into an opaque pattern.

Color film substrate, method for manufacturing the same, and display device

An array substrate, a method for manufacturing the same and a display device are provided. The array substrate includes an insulating layer and a conductive structure in the non-display region. The insulating layer includes at least one aperture in the non-display region. The aperture has a one-to-one correspondence with the conductive structure. The conductive structure is within the aperture, and the surface of the conductive structure is lower than the surface of the insulating layer.

Array substrate, method for manufacturing the same and display device including the array substrate

The present disclosure provides a backlight module and a method of manufacturing the same, as well as a back plate and a display device, the backlight module comprising: a backlight strip; a solder spot disposed on a back surface of the backlight strip; light strip glue attached to the side of the backlight strip on which the solder spot is disposed; and a back plate disposed on the side of the light strip glue away from the backlight strip; wherein a groove is provided on the side of the back plate adjacent to the light strip glue and at a position corresponding to the solder spot.

Backlight module and a manufacturing method thereof, back plate and display device

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Beijing, China

Dongzhao Li