Samsung Electronics Co., Ltd.

Dongyoon Koo

Hyungjin Kim

Yunpyo Hong

Jungyu Lee

Sangwoo Bae

Minhwan Seo

Sungmin Ahn

Wondon Joo

Jiyoung Chu

A method of bonding a die to a wafer using a die bonding system measures, using an obtained image showing interference fringes, a parallelism between the die and the wafer. In some embodiments, parallelism and die deformation are detected using interference fringes produced by an optical apparatus of the die bonding system. A parallelism measurement optical apparatus includes a light source, an optical assembly configured to control polarization of a reference light and a measurement light. In some embodiments, the measurement light is sequentially incident on and reflected from a first measurement surface and a second measurement surface that are spaced apart along a vertical direction to face each other, and is emitted to have information on parallelism between the first and second measurement surfaces. In some embodiments, a first polarizer is configured to interfere the reference light and the measurement light emitted from the optical assembly with each other. A light detector is configured to detect an interference signal of lights including the interference fringes.

Optical assembly for parallelism measurement, optical apparatus including the same, die bonding system and die bonding method using the same

Growing community of inventors

Suwon-si, South Korea

Dongyoon Koo