Lsi Logic Corporation

Dongyi Zhou

Matthew Russell

Dushyant Narayen

A bus layout design is provided which includes a first electrically conductive layer with a first bus and a second bus and a second electrically conductive layer with a first bus and a second bus. Vias are provided between the first electrically conductive layer and the second electrically conductive layer such that the first bus and the second bus of the first electrically conductive layer are electrically connected.

Growing community of inventors

Sunnyvale, CA, United States of America

Dongyi Zhou