Other

Phicom Corporation

Dongweon Seo

Juntae Hwang

The present invention relates to a method of manufacturing an interconnect device for a printed circuit board. According to one aspect of the present invention, a method of manufacturing an interconnect device comprises forming a protective film pattern on a sacrificial substrate for forming an interconnect device including a first contact section having a bar-like shape for making contact with a second contact terminal in a space transformer, a connecting section having an O-ring-like shape of which one side is opened and connected to one end of the first contact section in an integrated manner, a support section having an engaging protrusion in a predetermined portion and connected to one end of the connecting section in an integrated manner, and a second contact section having an O-ring-like shape and connected to one end of the support section in an integrated manner; filling a conductive material into the inside of the protective pattern, and removing the protective film pattern and the sacrificial substrate to finish the interconnect device.

Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same

An interconnect assembly including a contact, a first guide film, a space transformer, a second guide film, and an interconnect device including a second contact section having an O-ring-like shape to be inserted into the contact hole by an interference fit, a support section having an engaging protrusion in a predetermined portion and connected to the second contact section in an integrated manner to be inserted into the inside of the first guide opening, a connecting section having an O-ring-like shape of which one side is opened and connected to the support section in an integrated manner thereby being placed between the first guide film and the second guide film, and a first contact section connected to the connecting section in an integrated manner for making contact with the second contact section through the second guide opening.

The present invention relates to an interconnect device for a printed circuit board, a method of manufacturing the same and an inter-connect assembly having the same. According to one aspect of the present invention, the interconnect device for a printed circuit board comprises: a first contact sectionhaving a bar-like shape for making contact with a second contact terminalin a space transformer; a connecting sectionhaving an O-ring-like shape of which one side is opened and connected to one end of the first contact sectionin an integrated manner; a support sectionhaving an engaging protrusionin a predetermined portion and connected to one end of the connecting sectionin an integrated manner; and a second contact sectionhaving an O-ring-like shape and connected to one end of the support section, wherein the whole inter-connect device is made up of an identical resilient material. According to still another aspect of the present invention, an interconnect assembly having an interconnect device for a printed circuit board, comprises: a printed circuit boardincluding a contact holein which a conductive filmconnected to an internal circuitry is formed on the inside wall; a first guide filmfixed on a bottom surface of the printed circuit boardand having a first guide openingto o pen the contact hole; a space transformer having a second contact terminalon a top portion and a bumpin the vicinity of the second contact terminal; a second guide filmfixed on the space transformer, supported by the bump, and having a second guide openingto be related with the bump; and an interconnect deviceincluding a second contact section having an O-ring-like shape to be inserted into the contact holeby an interference fit, a support section connected to the second contact section in an integrated manner to be inserted into the inside of the first guide opening, a connecting section having an O-ring-like shape of which one side is opened and connected to the support section in an integrated manner thereby being placed between the first guide film and the second guide film, and a first contact section connected to the connecting section in an integrated manner for making contact with the second contact sectionthrough the second guide opening.

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Euiwang, South Korea

Dongweon Seo