Samsung Electronics Co., Ltd.

Dongsoo Lim

Heejin Kim

Jun Cheol Cho

Kyoungjun Kim

Jaeyoo Jeong

Chinwoo Kim

Jongwook Ju

Yongchul Kang

Jeongje Moon

Provided is a light source module including a package body having a groove portion, a semiconductor light emitting diode (LED) chip provided on a bottom surface of the groove portion, the semiconductor LED chip being configured to emit light based on a first driving voltage applied thereto, a variable light transmission unit provided on the groove portion and having light transmissivity varying based on a second driving voltage applied thereto, a first electrode side surface and a second electrode side surface provided on side surfaces of the groove portion and connecting the bottom surface of the groove portion to the variable light transmission unit, and a processor configured to control application of the first driving voltage to the semiconductor LED chip and the second driving voltage to the variable light transmission unit.

Light source module and mobile device including the same

A light emitting device package includes a first light emitting diode pixel, the first light emitting diode pixel including first light emitting diode chips that each emit light, and a first pixel driving integrated circuit under the first light emitting diode chips of the first light emitting diode pixel, the first pixel driving integrated circuit configured to drive the first light emitting diode chips based on an active matrix scheme, in which each of the first light emitting diode chips is driven using an entire one frame interval, and based on a pulse width modulation scheme, in which a time during which each of first driving currents is applied to a respective one of the first light emitting diode chips is controlled within the entire one frame interval.

Light emitting device package and display device including the same

Growing community of inventors

Seoul, South Korea

Dongsoo Lim