Samsung Electronics Co., Ltd.

Korea Advanced Institute of Science and Technology

Dongmin Keum

Bumsuk Kim

Min Hee Jang

Taesub Jung

Jonghoon Park

Jung-Saeng Kim

Changrok Moon

Hyukjin Jung

Ki-Hun Jeong

Taehan Kim

Kwanghee Lee

Yunki Lee

Junsung Park

Kyungwon Jang

Jae-Jun Kim

Yeaju Jang

An image sensor includes a pixel array in which a plurality of normal pixels and a plurality of autofocus (AF) pixels are disposed, and a logic circuit. The logic circuit provides an autofocus function using a phase difference between pixel signals obtained from each of the plurality of AF pixels. Each of the AF pixels includes a single AF lens disposed on a pair of pixel areas. An AF lens of the AF pixel spaced apart from a center of the pixel array may have an area larger than an area of the AF lens of the AF pixel adjacent to the center.

Image sensor with size-variable autofocus lenses

A pixel array of an image sensor includes a plurality of pixel groups. Each pixel group includes a plurality of unit pixels adjacent to each other and respectively including photoelectric conversion elements disposed in a semiconductor substrate, a color filter shared by the plurality of unit pixels, and a plurality of microlenses disposed on the color filter and having sizes different from each other such that the plurality of microlenses respectively focus an incident light to the photoelectric conversion elements included in the plurality of unit pixels. Deviations of sensing sensitivity of unit pixels are reduced and quality of images captured by the image sensor is enhanced by adjusting sizes of microlenses.

Pixel array of image sensor and method of manufacturing the same

Optical sensors including a light-impeding pattern are provided. The optical sensors may include a plurality of photoelectric conversion regions, a plurality of lenses on the plurality of photoelectric conversion regions, and a light-impeding layer extending between the plurality of photoelectric conversion regions and the plurality of lenses. The light-impeding layer may include an opening between a first one of the plurality of photoelectric conversion regions and a first one of the plurality of lenses. The optical sensors may be configured to be assembled with a display panel such that the plurality of lenses are disposed between the light-impeding layer and the display panel.

Optical sensors including a light-impeding pattern

Provided are an ultrathin digital camera inspired by an eye of an insect, that includes a prism array including a plurality of transmission channels refracting incident light and a micro lens array including micro lenses focusing the light and is implemented so that the respective transmission channels receive visual information on partial regions of an entire field of view (FOV) like a visual organ of the eye of the insect, and a method of manufacturing the same.

Ultrathin digital camera and method of manufacturing the same

Provided is a batch fabrication method of three-dimensional photonic microstructures including a support structure fabricating step, a variable structure fabricating step, a thermal reflow step, and a three-dimensional photonic microstructure forming step. The batch fabrication method of three-dimensional photonic microstructures fabricates three-dimensional photonic microstructures having several shapes depending on a demand of a user through these steps.

Batch fabrication method of three-dimensional photonic microstructures

Growing community of inventors

Daegu, South Korea

Dongmin Keum