Hisense Broadband Multimedia Technologies Co., Ltd.

Hisense Broadband Multimedia Technologies, Ltd.

Dongmei Yu

Wei Zhao

Jianwei Mu

Benzheng Dong

Fabu Xu

Fei Liu

Jianwei Yao

Congwen Luo

This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.

Optical module

The present disclosure provides an optical module, including a circuit board, an optical chip and an optical chip driver. Where the circuit board includes a first layer provided with a first ground plane, a second layer provided with a second ground plane and a high-speed signal line between the first ground plane and the second ground plane. At least a part of the high-speed signal line is enclosed in a shielding cage which is formed by the first ground plane, the second ground plane and a plurality of metal vias connecting the first ground plane and the second ground plane in a way that the at least a part of the high-speed signal line is electromagnetic shielded by the shielding cage.

Growing community of inventors

Qingdao, China

Dongmei Yu