Samsung Electronics Co., Ltd.

Dongkyun Lee

Seungjin Kim

Cheonbae Kim

Yoonyoung Choi

Sangjae Park

A semiconductor device is provided. The semiconductor device includes a plurality of lower electrodes arranged on a semiconductor substrate in a honeycomb structure; and a support connected to the plurality of lower electrodes and defining a plurality of open areas through which the plurality of lower electrodes are exposed. A center point of each of the plurality of open areas is arranged at a center point of a triangle formed by center points of three corresponding neighboring lower electrodes among the plurality of lower electrodes.

Semiconductor device and method of fabricating the same

An integrated circuit device including a lower electrode on a substrate, the lower electrode including a first lower electrode portion extending in a first direction perpendicular to a top surface of the substrate and including a first main region and a first top region, and a second lower electrode portion extending in the first direction on the first lower electrode portion and including a second main region and a second top region; a first top supporting pattern surrounding at least a portion of a side wall of the first top region of the first lower electrode portion; and a second top supporting pattern surrounding at least a portion of a side wall of the second top region of the second lower electrode portion, and the second lower electrode portion includes a protrusion protruding outward to the second top supporting pattern.

Growing community of inventors

Seoul, South Korea

Dongkyun Lee