Samsung Electronics Co., Ltd.

Sk Telecom Company, Ltd.

Samsung Eleotronicc Co., Ltd

Dongkyun Kim

Seonkeun Park

Hyoungshin Park

Seungho Jang

Yunjin Kim

Minah Koh

Jinie Ryu

Jiyoung Lee

Kukhwan Kim

Sungjin Yum

Hakdo Kim

Seogwoo Hong

Jinmyoung Kim

Sol Lee

Donghun Kim

Namhyun Kang

Seokwhan Chung

Mingeun Kim

Hyunjoon Kim

Jongbo Jung

Joonyong Park

Jingu Heo

Kyungwook Hwang

Byungkyu Lee

Sanghun Lee

Hongsuk Kim

Byounglyong Choi

Junsik Hwang

Sunghyun Nam

Jaechul Park

Seokyoon Jung

Huijin Lee

Younghun Sung

YangHo Cho

Byeungwoo Jeon

Haekwang Kim

Yunglyul Lee

Joohee Moon

Dongho Kim

Daeyeon Kim

Hyuck Choo

Seokho Song

Hayoon Kim

Sunwoong Ham

Daehyuk Son

Kyunghyun Son

Minchul Yu

Kihun Han

Jinhee Nam

A micro light-emitting element includes a first conductivity type semiconductor layer including a lower surface on which an uneven pattern is formed, an active layer provided on the first conductivity type semiconductor layer, a second conductivity type semiconductor layer provided on the active layer, at least one electrode provided on the second conductivity type semiconductor layer, and a transparent coating layer including a first surface covering the lower surface of the first conductivity type semiconductor layer, and a second surface facing the first surface and having a second surface roughness that is less than a first surface roughness of the lower surface of the first conductivity type semiconductor layer.

Micro light-emitting element, micro light-emitting element array including the micro light-emitting element, and display device including the micro light-emitting element array

A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.

Device transfer substrate receiving a light emitting device, device transfer structure, and display apparatus

Provided is a thermal infrared detector including a thermal infrared sensor array including a plurality of resistive infrared devices that are provided in a plurality of rows and a plurality of columns, and a driving circuit configured to drive the thermal infrared sensor array, wherein at least two resistive infrared devices among the plurality of resistive infrared devices adjacent to each other in a row direction or a column direction are grouped together, wherein at least one resistive infrared device among the plurality of resistive infrared devices is shared by at least two groups, and wherein at least two resistive infrared devices among the plurality of resistive infrared devices that are included in each of the at least two groups are connected in series.

Thermal infrared detector

Case for electronic device

A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

Chip transfer apparatus

Electronic device

Tablet computer

A long-wave infrared detecting element includes a magnetic field generator configured to generate a magnetic field; a substrate on the magnetic field generator; a superparamagnetic material layer disposed to be separated from the substrate and magnetized by the magnetic field generated by the magnetic field generator; a support unit on the substrate to support the superparamagnetic material layer such that the superparamagnetic material layer separated from the substrate, such that the support unit and the superparamagnetic material layer generate heat by absorbing infrared radiation from the outside; and a magneto-electric conversion unit that generates an electrical signal proportional to both a strength of the magnetic field generated by the magnetic field generator and the magnetization of the superparamagnetic material layer.

Long-wave infrared detecting element, long-wave infrared detecting element array structure, long-wave infrared temperature detecting device, and thermal imaging device

Provided is a long-wave infrared detecting element including a magnetic field generator configured to generate a magnetic field, a substrate provided on the magnetic field generator, a magnetic-electric converter that is spaced apart from the substrate and configured to generate an electrical signal based on the magnetic field generated by the magnetic field generator, and an support unit that is provided on the substrate and supports the magnetic-electric converter in a state in which the magnetic-electric converter is spaced apart from the substrate, the support unit being configured to generate heat by absorbing incident infrared radiation, wherein the electrical signal changes corresponding to temperature changes of the magnetic-electric converter based on the incident infrared radiation directly absorbed in the magnetic-electric converter and temperature changes of the magnetic-electric converter based on the incident infrared radiation absorbed in the support unit.

Long-wave infrared detecting element, array structure of long-wave infrared detecting elements, long-wave infrared temperature detecting device, and thermal imaging device

Cover for electronic device

Keyboard for electronic device

Provided is a method of processing data corresponding to a fingerprint image including obtaining first image data corresponding to a group including a plurality of pixels, and dividing the first image data into second image data corresponding to each of the plurality of pixels based on a plurality of weights corresponding to the plurality of pixels, respectively.

Method and apparatus for processing data corresponding to fingerprint image

Growing community of inventors

Seoul, South Korea

Dongkyun Kim