Growing community of inventors

Suwon-si, South Korea

Donghyun Byun

Average Co-Inventor Count = 5.10

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 15

Donghyun ByunChongkun Cho (5 patents)Donghyun ByunSeunghyun Hwang (4 patents)Donghyun ByunUyhyeon Jeong (4 patents)Donghyun ByunSukjin Yun (4 patents)Donghyun ByunJongkeun Kim (3 patents)Donghyun ByunByounguk Yoon (2 patents)Donghyun ByunHun Rae Kim (2 patents)Donghyun ByunMinsung Lee (2 patents)Donghyun ByunDaehyeong Park (2 patents)Donghyun ByunJongmin Choi (2 patents)Donghyun ByunJaehee Kim (2 patents)Donghyun ByunWonhee Choi (2 patents)Donghyun ByunSunggun Cho (2 patents)Donghyun ByunIksu Jung (2 patents)Donghyun ByunYonghwa Han (1 patent)Donghyun ByunHun Sung Kim (7 patents)Donghyun ByunDonghyun Byun (7 patents)Chongkun ChoChongkun Cho (16 patents)Seunghyun HwangSeunghyun Hwang (22 patents)Uyhyeon JeongUyhyeon Jeong (11 patents)Sukjin YunSukjin Yun (11 patents)Jongkeun KimJongkeun Kim (18 patents)Byounguk YoonByounguk Yoon (86 patents)Hun Rae KimHun Rae Kim (65 patents)Minsung LeeMinsung Lee (36 patents)Daehyeong ParkDaehyeong Park (29 patents)Jongmin ChoiJongmin Choi (23 patents)Jaehee KimJaehee Kim (21 patents)Wonhee ChoiWonhee Choi (16 patents)Sunggun ChoSunggun Cho (15 patents)Iksu JungIksu Jung (13 patents)Yonghwa HanYonghwa Han (12 patents)Hun Sung KimHun Sung Kim (7 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Samsung Electronics Co., Ltd. (7 from 131,744 patents)


7 patents:

1. 12498766 - Hinge assembly and electronic device including the same

2. 12279387 - Hinge assembly and electronic device including the same

3. 12216508 - Arm structure, hinge structure including the arm structure, and electronic device including the same

4. 12066872 - Hinge assembly and electronic device including the same

5. 11809239 - Arm structure, hinge structure including the arm structure, and electronic device including the same

6. 11402872 - Electronic device with bonding structure

7. 10860061 - Electronic device with bonding structure

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as of
1/3/2026
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