Semes Co., Ltd.

Donghyuk Seo

Sung Yong Lee

Gyu Hyun Kim

Seo Jung Park

Tae Sub Lee

An apparatus for treating a substrate includes a housing having a treatment space therein, a heating plate that supports the substrate in the treatment space and that has a plurality of heating members inside, and a temperature control unit that controls the plurality of heating members to heat the substrate supported on the heating plate, in which the temperature control unit controls the plurality of heating members using a plurality of control signals with different control periods.

Apparatus and method for treating substrate

An apparatus for treating a substrate includes a housing having a treatment space therein, a plate that supports the substrate in the housing, a heating unit having a heating wire that is provided inside the plate and that heats the substrate, a main temperature sensor that directly measures temperatures of the plate, and an auxiliary temperature sensor that measures temperatures of the heating wire.

An apparatus for treating a substrate is disclosed. The apparatus for treating the substrate includes a housing having a treatment space inside the housing, a plate to support the substrate inside the housing, a heating member provided inside the plate to heat the substrate and including a plurality of heating zones, a temperature measuring member to measure a temperature of the substrate with respect to each of the plurality of heating zones of the heating member, and a control unit to control a temperature for the heating member in a dynamic section of a temperature change graph measured in the temperature measuring member. The control unit performs temperature control with respect to each of the plurality of heating zones of the heating member to uniformize the thickness of the thin film on the substrate.

Growing community of inventors

Cheonan-si, South Korea

Donghyuk Seo