Samsung Electronics Co., Ltd.

Dongchul Ihm

Jeongho Ahn

Chungsam Jun

Dongryul Lee

Doyoung Yoon

Yusin Yang

Seongsil Lee

Jae-Man Oh

Hyungsuk Cho

A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

Inspection system of semiconductor wafer and method of driving the same

A substrate inspection system includes a substrate support, optics configured to irradiate a patterned structure on the substrate and capture images of the patterned structure from light reflected from the patterned structure, a focus adjustment operative to adjust a focal position of the incident light on the patterned structure, and an image processor configured to calculate an optimal value of a focus offset used to establish focal points of the light for defect detection in the patterned structure. The patterned structure may include a first pattern having an opening and a second pattern having top surfaces located at different heights relative to the substrate. The value of the focus offset is determined using images of the top surfaces of the second pattern obtained while changing the focal position of the incident light.

System and method of inspecting substrate and method of fabricating semiconductor device using the same

Growing community of inventors

Suwon-si, South Korea

Dongchul Ihm