Shanghai Biren Technology Co., Ltd

DongCai Li

WenQi Li

Linglan Zhang

YiKai Liang

Zheng Tian

Tingting Yu

Junhai Liu

A semiconductor die is provided. The semiconductor die includes a D2D transceiver composed of a single die or dual dies. The D2D transceiver includes a first D2D transmitter and a first D2D receiver. The D2D transmitter is configured to send data to a second D2D receiver in a second D2D transceiver of another semiconductor die using a first reference clock signal. The D2D receiver is configured to receive data from a second D2D transmitter in the second D2D transceiver using a second reference clock signal. Through using the embodiments of the disclosure, a transmission solution may be flexibly configured for a multi-application scenario including D2D.

Semiconductor die, electronic component, electronic apparatus and manufacturing method thereof

The disclosure provides a clock step control circuit and a method thereof. The clock step control circuit includes a clock divider, a multiplexer, and a controller. The clock divider receives a first clock signal and outputs multiple second clock signals. The multiplexer receives the second clock signals and outputs one of the second clock signals. The controller is coupled to the clock divider and the multiplexer. When the controller receives an interrupt signal, the controller outputs a selection signal to the multiplexer according to the interrupt signal. The multiplexer outputs another one of the second clock signals according to the selection signal. The clock step control circuit and the method thereof in the disclosure can appropriately switch the clock signal to output a clock signal with an appropriate clock frequency.

Clock step control circuit and method thereof

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Shanghai, China

DongCai Li