Samsung Electronics Co., Ltd.

Semes Co., Ltd.

Dongbock Lee

Ki Yung Lee

Dongyoon Lee

Minjae Na

Hyun Su Jun

DooByeong Park

YongKyu Kim

Bongsun Kim

Jaehong Jeong

The apparatus includes a chamber having a treating space for treating the substrate, a substrate support unit for supporting the substrate in the treating space, a gas supply unit for supplying gas into the treating space, and a plasma source for generating plasma from the gas supplied to the treating space, wherein the gas supply unit includes a shower head unit disposed in a top portion of the chamber so as to face away the substrate support unit, wherein a plurality of discharge holes are defined in the shower head unit, wherein the gas is discharged through the discharge holes, and a gas block for supplying the gas to the shower head unit, wherein the shower head unit has partitioned regions defined therein communicating with the discharge holes respectively, wherein the gas block supplies the gas to the partitioned regions at different flow rates.

Substrate treating method and substrate treating apparatus

Plasma equipments are provided. The plasma equipment includes a chamber in which a plasma reaction occurs, a detector outputting a spectrum signal in response to light generated from the plasma reaction, and a plasma monitoring module determining whether the spectrum signal includes an arcing signal or a hunting signal. Related methods are also provided.

Plasma equipment and methods of using the same

Growing community of inventors

Suwon-si, South Korea

Dongbock Lee