Texas Instruments Corporation

Dongbin Hou

Yuki Sato

Jeffrey Anthony Morroni

Sombuddha Chakraborty

Kenji Kawano

Steven Alfred Kummerl

Roberto Giampiero Massolini

Joyce Marie Mullenix

A device includes a first inductor and a second inductor reversely coupled with the first inductor. The first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor. The housing is filled with a magnetic molding compound.

Module with reversely coupled inductors and magnetic molded compound (MMC)

An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.

Integrated inductor with magnetic mold compound

A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.

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Plano, TX, United States of America

Dongbin Hou