Other

Skhynix Inc.

Hynix Semiconductor Inc.

Dong You Kim

Jong Hyun Kim

Jae Sung Oh

Moon Un Hyun

Jin Ho Gwon

Ki Seok Cha

Yong Tae Kyeon

Ki Bon Cha

Ja Yong Ku

A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip.

Semiconductor package and stacked semiconductor package having the same

The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a first surface, a second surface and a third surface thereof. Each signal pad array includes a plurality of signal pads. An electronic component socket for coupling with the printed circuit board includes thee pin arrays. Thus, an increased number of the signal pads can be provided while retaining the size of the memory module and the electronic component socket.

Semiconductor memory module and electronic component socket for coupling with the same

Disclosed are a stack package and a fabricating method thereof using a ball grid array semiconductor package (hereinafter, referred to as 'BGA PKG'). The stack package can easily electrically connect the stacked BGA PKGs with each other by simplifying a stack structure between the BGA PKGs, and increase bonding reliability by improving bonding force bonded portions of solder balls of substrates.

Stack package and fabricating method thereof

Growing community of inventors

Chungcheongbuk-do, South Korea

Dong You Kim