Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Dong Yeoul Lee

Yong Tae Kim

Kyeong Ik Min

Tae Hun Kim

Hyung Jin Kim

Su Yeol Lee

Jae Yoon Kim

Sang Ho Yoon

Ki Un Lee

Min Sang Lee

Chang Mo Lee

Chang Sub Lee

Young Kyu Sung

Gam Han Yong

A semiconductor light emitting device including a floating conductive pattern is provided. The semiconductor light emitting device includes a first semiconductor layer including a recessed region and a protruding region, an active layer and a second semiconductor layer disposed on the protruding region, a contact structure disposed on the second semiconductor layer, a lower insulating pattern covering the first semiconductor layer and the contact structure, and having first and second openings, a first conductive pattern disposed on the lower insulating pattern and extending into the first opening, a second conductive pattern disposed on the lower insulating pattern and extending into the second opening, and a floating conductive pattern disposed on the lower insulating pattern. The first and second conductive patterns and the floating conductive pattern have the same thickness on the same plane.

Semiconductor light emitting device including floating conductive pattern

A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a portion of the light emitted from the LED chip into light in a different wavelength region. The wavelength-converted layer is formed on an upper surface of the LED chip, and has a convex meniscus-shaped upper surface.

Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip

A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads.

Light emitting device package and manufacturing method thereof

There are provided an optical lens and a light source module, and a street lamp having the same. The optical lens includes a concave dome shaped inner surface formed to have a similarly-oval shaped lower surface, and formed to include a plurality of light incident surfaces formed to be stepped along the inner surface thereof and stepped surfaces connecting the plurality of light incident surfaces to one another; and an outer surface formed to surround the inner surface.

Optical lens and light source module, and street lamp having the same

A surface light source device using light emitting diodes, the device including: a housing having a top opening to emit light; a light emitting diode board disposed on an inner bottom surface of the housing, the board on which a plurality of light emitting diodes are arranged; and a color conversion laminate formed by depositing a plurality of phosphor-mixed resin layers containing phosphors, the layers disposed at a top of the opening of the housing and providing light having different wavelengths.

Surface light source device using light emitting diodes

Growing community of inventors

Gyunggi-do, South Korea

Dong Yeoul Lee