Samsung Electro-mechanics Co., Ltd.

Dong Yeong Kim

Woo Chul Shin

Ji Hong Jo

Je Jung Kim

Dong Hwi Shin

Do Yeon Kim

Min Hyang Kim

Chae Min Park

Eun Hee Jeong

Jeong Mo Kang

Chung Hyeon Ryu

Seung Been Kim

Byeong Guk Choi

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Multilayer electronic component for enhanced moisture resistance and bending strength

A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is 'a', and a thickness of the first and second conductive layers at an end of the capacitance formation portion is ‘b’, ‘b/a’ is 0.07 or more.

Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrode

A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other having the dielectric layer interposed therebetween; and external electrodes including electrode layers positioned externally on the body and connected to the internal electrodes, respectively, wherein the body includes a first surface and a second surface, opposing each other, and to which the plurality of internal electrodes are respectively exposed, and a third surface and a fourth surface which are connected to the first surface and the second surface, and oppose each other in a direction in which the plurality of internal electrodes are stacked on each other, each of the electrode layers including a first region covering the first or second surface and a second region covering the third or fourth surface and having surface roughness lower than that of the first region.

Multilayer capacitor

A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.

Ceramic electronic component

A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.

Multi-layered ceramic electronic component

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region in which an electrode layer and a conductive resin layer are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between a conductive resin layer and a plating layer of an external electrode, and thus, may improve bending strength and moisture resistance reliability.

Multilayer electronic component including a silicon organic compound layer arranged between layers of an external electrode

A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1&#x2264;t5/(t3+t4)*100&#x3c;17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3&#x2264;t5/(t3+t4)*100&#x3c;4.38 in the case in which t3+t4 is more than 100 micrometers.

A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is 'a', and a thickness of the first and second conductive layers at an end of the capacitance formation portion is 'b', &#x2018;b/a&#x2019; is 0.07 or more.

A multilayer electronic component in the example embodiment includes a Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of a body between external electrodes and an extended portion extending from the body covering portion to a region between a plating layer and an additional plating layer of the external electrode, thereby having improved warpage strength and moisture resistance.

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Suwon-si, South Korea

Dong Yeong Kim