Samsung Electronics Co., Ltd.

Dong-won Jung

Sang-jun Choi

Sook Jin Lee

Si-hyeung Lee

Hyun-woo Kim

Sang-gyun Woo

Kwang-sub Yoon

Ki-young Kwon

Si-hyueng Lee

A resist composition includes a photoacid generator (PAG) and a photosensitive polymer. The photosensitive polymer is polymerized with (a) at least one of the monomers having the respective formulae: where R1 and R2 are independently a hydrogen atom, alkyl, hydroxyalkyl, alkyloxy, carbonyl or ester, and x and y are independently integers from 1 to 6, and (b) at least one of a (meth)acrylate monomer, a maleic anhydride monomer, and a norbornene monomer.

Resist composition comprising photosensitive polymer having lactone in its backbone

The photosensitive polymer includes a first monomer which is norbornene ester having Cto Caliphatic alcohol as a substituent, and a second monomer which is maleic anhydride. A chemically amplified photoresist composition, containing the photosensitive polymer, has an improved etching resistance and adhesion to underlying layer materials, and exhibits wettability to developing solutions.

Photosensitive polymer and chemically amplified photoresist composition containing the same

This invention is directed to a coating composition used for original equipment manufacturing or refinishing uses in the automotive industry, which coating composition utilizes an acrylic polymer which contains substituted or unsubstituted exomethylene lactones or lactams as a comonomer.

A photosensitive polymer which maintains transparency even when exposed to a short-wavelength light source of 193 nm or below, exhibits improved adhesiveness to a substrate, improved contrast and improved resistance to dry etching. The photosensitive polymer includes a first monomer which is alicyclic hydrocarbon carboxylate having an acid-labile C to C tertiary alicyclic hydrocarbon group as a substituent, and a second monomer which is capable of free radical polymerization.

Photosensitive polymer

Photosensitive polymer and resist composition containing the same

The photosensitive polymer includes a first monomer which is norbornene ester having C to C aliphatic alcohol as a substituent, and a second monomer which is maleic anhydride. A chemically amplified photoresist composition, containing the photosensitive polymer, has an improved etching resistance and adhesion to underlying layer materials, and exhibits wettability to developing solutions.

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Yongin, South Korea

Dong-won Jung