Mosel Vitelic Corporation

Dong-Tay Tsai

Hua-Jen Tseng

Pei-Wei Tsai

Yi-Hua Chin

Chun-Chieh Lee

Chun-chieh Lee

Chih-Hsien Chang

Hua-jen Tseng

Fu-Chih Huang

A chemical mechanical polishing apparatus has a plurality of electric machines for executing mechanical polishing motions, at least two control systems for controlling the mechanical polishing motions, at least two signal wires connected with the two control systems for transmitting signals of the two control systems, and a wave filter comprising two terminals connected with the two signal wires respectively for filtering out the signal whose voltage exceeds a predetermined value in the two signal wires.

Chemical mechanical polishing apparatus with stable signals

An inspection device for examining a piece of aperture graphite of an extraction electrode, and the aperture graphite includes a to-be-examined curve and a to-be-examined engagement portion. The inspection device includes a sidewall surface having a standard curve marked thereon, and an examination engagement portion having a predetermined positional relationship with the sidewall surface. After the to-be-examined engagement portion is engaged with the examination engagement portion, and after the to-be-examined curve is projected onto the sidewall surface, the suitability of the aperture graphite can be determined according to the amount of differences between the projected to-be-examined curve and the standard curve.

Inspection device for examining a piece of aperture graphite of an extraction electrode

A novel insulating apparatus for a conductive line is disclosed. The proposed insulating apparatus can be applied to various conductive lines with different shapes. The problem of short circuit can be solved by the present insulating apparatus with the novel connecting configuration. The present invention comprises a plurality of insulator rings worn on the conductive line in series, wherein the insulator rings are annular cylinders. Each of the annular cylinders has an outer diameter larger than the inner diameter of the ones next to it. In addition, each of the annular cylinders has a length sized according to the desired flexibility of the conductive line.

Insulating apparatus for a conductive line

A slurry nozzle for supplying slurry in chemical mechanical polishing (CMP) including at least one slurry line, a slurry nozzle enclosure for accommodating the slurry line, and a baffle ring mounted at one end of the slurry nozzle enclosure. A plurality of apertures is formed on the sidewall of the slurry line for the slurry to spray out. The slurry spraying out from the slurry line flows down along the inner sidewall of the slurry baffle ring after the slurry impinges onto the slurry baffle ring.

Slurry nozzle

The present invention relates to an ion source chamber of a high energy implanter. The ion source chamber comprises a main chamber for generating ions for ion implantation, a vent-pipe having two open ends, one end of the vent-pipe being connected to the main chamber for releasing air from the main chamber, a releasing valve connected to another end of the vent-pipe for releasing the air in the main chamber when the pressure of the air in the main chamber exceeds a predetermined pressure, and a filtering device installed between the vent-pipe and the releasing valve for filtering impurities contained in the air carried by the vent-pipe so as to prevent the impurities from falling into the releasing valve.

Ion source chamber of a high energy implanter with a filtering device

A height gauge device for wafer, which is mounted under a cooling water pipe of a back-grinding machine; the device comprises a height gauge box, a measuring rod, a L-shaped linking rod and a resilient member; a signal sensor is mounted inside the height gauge box for measuring the height of a wafer; both ends of the measuring rod are connected with the signal sensor and the L-shaped linking rod respectively; the L-shaped linking rod is mounted with a probing needle; the resilient member is mounted between the L-shaped linking and the cooling water pipe; in height gauging operation, the probing needle on the L-shaped linking needle should be raised first so as to put a wafer under the probing needle, and to have the probing needle pressed against the wafer by means of the resilient force of the resilient member; consequently, the resilient member is subject to elastic fatigue or break; the resilient member of the height gauge device can be replaced directly without opening the height box so as to save time and maintenance cost.

Growing community of inventors

Kaohsiung, Taiwan

Dong-Tay Tsai