Lg Innotek Co., Ltd.

Dongbu Daewoo Electronics Corporation

Lg Semicon Co., Ltd.

Hyundai Electronics Industries Co. Ltd.

Kia Motors Corporation

Other

Hyundai Motor Company

Dong Sun Kim

Sung Wuk Ryu

Ji Haeng Lee

Hyun Seok Seo

Seung Yul Shin

Dong Jin Shin

Sung Yun Kim

Sang Hyuck Nam

Kyu Ho Kim

Ki Chul Park

A circuit board according to an embodiment includes an insulating layer including an upper surface and a lower surface, and having a via hole passing through the upper surface and the lower surface in a thickness direction from the upper surface to the lower surface, wherein the via hole includes: a first via part adjacent to the upper surface and having a constant inclination angle along the thickness direction; a second via part adjacent to the lower surface and having a constant inclination angle along the vertical direction; and a third via part disposed between the first via part and the second via part and having an inclination angle different from an inclination angle of the first via part and an inclination angle of the second via part.

Circuit board

The printed circuit board, according to one embodiment, comprises: an insulation substrate; a pad formed on at least one side of the insulation substrate; a protection layer which is formed on the insulation substrate and exposes an upper surface of the pad; and a bump formed on the pad exposed by the protection layer, wherein the bump comprises a plurality of solder layers having melting points different from each other.

Printed circuit board, package substrate comprising same, and method for manufacturing same

A dispenser assembly for a refrigerator including a removable discharge nozzle. The dispenser assembly includes a dispenser body, a water supply flow path and a removable discharge nozzle removably supported by a storage part formed in the dispenser body. The removable discharge nozzle is coupled to an extension hose can be pulled out of the dispenser body by a user for dispensing water. The removable discharge nozzle includes a discharge flow path, a rotating shaft installed in the discharge flow path, an opening/closing member, and a discharge button for user manipulation.

Dispenser assembly for refrigerator

A dispenser assembly for a refrigerator includes a dispenser body, a water supply flow path and a removable discharge nozzle removably placed in a storage part formed in the dispenser body. The removable discharging unit is coupled to an extension hose and can be pulled out of the dispenser body by a user for dispensing water.

A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.

Semiconductor package substrate, package system using the same and method for manufacturing thereof

An ice maker for refrigeration equipment includes an ice making unit in the refrigerating compartment of the refrigeration equipment, an ice bucket disposed in the ice making unit and configured to store the ice made with an ice making tray, a cooling duct configured to form a cold air channel through which cold air is provided to the ice making unit, a refrigerant pipe enclosing the cooling duct to form a refrigerant channel, and an ice making refrigerant pipe configured make water into the ice through heat-exchange, where the ice making refrigerant pipe branches from the refrigerant pipe, and an end portion of the ice making refrigerant pipe is in the ice making tray.

Apparatus and method for making ice by direct cooling and for preventing ice from melting in refrigeration equipment

A dispenser on refrigerator including a touch pad-type of lever for dispensing water supplied from a water purifier. The dispenser includes a main body, an ice discharge port, an ice guide, an ice discharge lever and a water discharge port. A PCB substrate is mounted on the front side of the ice guide. The touch pad-type lever is mounted on the PCB substrate and configured to receive a user request for discharging water and accordingly control a state of the water discharge port. The refrigerator also ice maker coupled to the dispenser, and detectors for detecting the amount of ice and water contained in the ice maker and the water purifier respectively. The touch pad on the touch pad-type of lever can display the amount of ice and water contained in the ice maker and the water purifier respectively.

Dispenser structure for refrigeration equipment, apparatus and method for controlling operation of same

A refrigerator with a single lever switch for a user to control dispensing both water and ice. A water/ice dispenser includes a main body, an ice discharge port disposed on one side of the main body, an ice guide coupled to the outlet of the ice discharge port, a water discharge port disposed on the other side of the main body, and an integral lever. The integral lever is coupled pivotally to the ice guide through its middle portion. One end of the integral lever serves as a water discharge button for a user to request dispensing water and the other end of the integral lever serves as an ice discharge button for a user to request dispensing ice.

Dispenser with an integral control switch for discharging water and ice on refrigerator

A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.

Printed circuit board and package substrate

Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate; and a post bump connected to the circuit pattern, provided on an external insulating layer of the first mounting area, and having a concave upper surface.

Printed circuit board having a post bump

A semiconductor package includes: an upper package to which an element is mounted, and which includes a metal pad portion; a metal post connected to the metal pad portion; and a lower package to which an element is mounted, and which is connected to the metal post.

Semiconductor package

A semiconductor package substrate includes an insulating substrate; a circuit pattern on the insulating substrate; a protective layer on the insulating substrate, the protective layer covering the circuit pattern on the insulating substrate; a pad on the protective layer; and an adhesive member on the protective layer, wherein the pad includes a first pad buried in the protective layer, and a second pad on the first pad, the second pad protruding over the protective layer.

Provided is a semiconductor package, including: a lower package to which elements are mounted; a metal post connected to the lower package and including at least one metal material portion; and an upper package to which elements is mounted, and which is connected to the metal post via a solder ball.

A dual muffler is provided which includes an inlet pipe, an end of which an exhaust gas is introduced from an engine. Additionally, an outlet pipe, an end of which is connected to an opposite end of the inlet pipe, branched at the opposite end of the inlet pipe running toward a side and the opposite side such that the exhaust gas from the inlet pipe is discharged through an opposite end is also provided. A housing covers the inlet pipe and the outlet pipe to expose the end of the inlet pipe and the opposite end of the outlet pipe to an outside environment; and a sound-absorbing material fills the interior space of the housing except for the remaining space where the inlet pipe and the outlet pipe.

Dual muffler

Disclosed herein is a system for assisting fuel-efficient driving, which can advise a driver to perform fuel-efficient driving by displaying a current fuel economy corresponding to a current driving state on a graph such that a driver can compare the current driving state with a target driving state for achieving an optimum fuel economy of the vehicle.

Growing community of inventors

Seoul, South Korea

Dong Sun Kim