Samsung Electronics Co., Ltd.

Samsung Sdi Co., Inc.

Dong-suk Kim

Ju-hee Kim

Shle-Ge Lee

Kyong-soon Cho

Dong-Il Shin

Yu-duk Kim

Young-Ki Park

Seok-Hyun Jung

A printed circuit board (PCB) reducing a thickness of a semiconductor package and improving reliability of the semiconductor package, a semiconductor package including the PCB, and a method of manufacturing the PCB may be provided. The PCB may include a substrate base having at least one base layer, and a plurality of wiring layers disposed on a top surface and a bottom surface of the at least one base layer, the plurality of wiring layers defining a plurality of wiring patterns, respectively may be provided. An elastic modulus of a conductive material of one wiring pattern of at least one wiring layer from among the plurality of wiring layers may be less than a conductive material of another wiring pattern.

Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board

An electrode composition, including a conductive powder; a glass frit; and an organic vehicle including an organic binder, a multi-functional (meth)acrylate compound, and a solvent, the multi-functional (meth)acrylate compound having a molecular weight of about 200 to about 500, and being present in an amount of about 0.15 wt % to about 2 wt % based on 100 wt % of the electrode composition.

Electrode composition, electrode manufactured using the same, and solar cell

Growing community of inventors

Suwon-si, South Korea

Dong-suk Kim