Skhynix Inc.

Dong Sub Kwak

Seung Won Lee

Nam Yeal Lee

A method for fabricating a semiconductor device includes: forming a dielectric layer over a substrate; forming a hole-shaped partial via in the dielectric layer; forming a line-shaped trench that partially overlaps with the partial via and has a greater line width than a line width of the partial via in the dielectric layer; forming a hole-shaped via that has a smaller line width than the line width of the partial via and penetrates the dielectric layer on a lower surface of the partial via; and gap-filling the via, the partial via and the trench with a conductive material, wherein a lower surface of the trench is positioned at a higher level than the lower surface of the partial via.

Growing community of inventors

Gyeonggi-do, South Korea

Dong Sub Kwak