Samsung Electronics Co., Ltd.

Dong-Su Kim

Joo-Hoon Lee

Sun-Tae Jung

Han-Seo Cho

Duk-Yong Choi

Byung-Sup Rho

Hyo-Hoon Park

Kyoung-Youm Kim

Hyo-Hun Park

An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.

Optical connection block, optical module, and optical axis alignment method using the same

A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.

Packaging apparatus for optical interconnection on optical printed circuit board

A planar light wave circuit is disclosed, which comprises: a first waveguide for receiving optical signals from an outside; a second waveguide having a first end surface and a second end surface, so that lights outputted from the first waveguide are partially reflected by the first end surface and are partially incidented into the first end surface and then outputted through the second end surface; a third waveguide for receiving the light reflected by the first end surface; and a common region bordering each end surface of the first to the third waveguides and having an index of refraction different from an index of refraction of the second waveguide.

Planar light wave circuit and optical performance monitoring module using the same

Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.

Flip-chip bonding structure and method for making the same

There is provided a silica microstructure fabrication method. An etch stop layer is first partially deposited on an etching area of a first silica layer formed on a semiconductor substrate. A second silica layer is deposited on the surfaces of the etch stop layer and the first silica layer. A mask patterned according to the shape of the etching area is formed on the surface of the second silica layer. The second silica layer is removed from the etching area using the mask by dry etching, and the etch stop layer is removed by wet etching. A silica microstructure which is manufactured according to the present method has the second silica layer removed according to a predetermined vertical profile to provide a precise removal of the overcladding layer in a microstructure.

Growing community of inventors

Anyang-shi, South Korea

Dong-Su Kim