Lg Electronics Inc.

Dong-Sik Youn

Su-Won Lee

Samchul Ha

Young-Man Jeong

Cheon-Soo Cho

Hyun-Wook Lee

Hyun-Woo Jun

Sam Chul Ha

Sam-Chul Ha

A surface treatment system is disclosed to form a deposition layer at a surface of an object of surface treatment by using a deposition reaction in which an electrode () for applying power to form a deposition reaction in the deposition chamber () is installed between an inner wall () of the deposition chamber () and an object of surface treatment () and further includes a cooling unit () installed at the inner wall () of the deposition chamber () facing the electrode () and cooling ambient thereof.

Surface treatment system and method

Disclosed are a surface treatment system that includes a deposition chamber () for forming a deposition layer at a surface of an object of surface treatment (); a carrier () for carrying the object of surface treatment () by mounting thereon, and a power applying unit () for forming a deposition reaction by applying a power to the object in the deposition chamber (), wherein the power applying unit () includes a fixed power applying unit () installed in the deposition chamber () and connected to an external power source (); and a movable power applying unit () installed at the carrier () for being electrically connected to the fixed power applying unit () movably as the carrier on which the object of surface treatment () is mounted goes into the deposition chamber and thereby applying a power to the object of surface treatment mounted on the carrier by contacting thereto.

Surface treatment system and method thereof

A surface treatment system in which gas for a deposition reaction is injected into a deposition chamber and power is applied to form a deposition reaction to form a deposition layer at a surface of an object or surface treatment, wherein the deposition chamber has a plurality of deposition spaces disposed in parallel and a convey unit for conveying one or more objects of surface treatment to each deposition space or discharging the objects of surface treatment from each deposition space after a deposition reaction.

An apparatus for fixing an eletrode of an electrode of plama polymerization apparatus is provided, which comprises; a nonconductive holder for fixing an electrode by covering an end part of the electrode, a leadline connecting the electrode with a power supply, and a fixing part fixing the holder on a chamber wall.

Apparatus for fixing an electrode in plasma polymerizing apparatus

A plasma polymerizing apparatus is provided which comprises at least one chamber in which sheet to be coated can be moved continuously, at least one gas inlet supplying reactive gas into the chamber, and at least one gas outlet exhausting the reactive gas out of the chamber, wherein the gas inlet and the gas outlet are disposed on the chamber in such a way that reactive gas flows in substantially parallel with moving direction of the sheet.

Supplying and exhausting system in plasma polymerizing apparatus

The present invention relates to an apparatus for forming polymer by DC plasma polymerization wherein a substrate is used as an electrode by applying a power to the substrate and an opposite electrode in a deposition chamber is positioned to both the surfaces of the substrate to be deposited. In addition, the present invention can acquire safety during the polymerization by insulating a main body from a substrate to which voltage is applied.

Apparatus for forming polymer continuously on the surface of metal by DC plasma polymerization

The present invention relates to a plasma polymerizing apparatus comprises a polymerizing chamber polymerizing surface of substrates by high voltage discharge, a discharge electrode installed inside of the polymerizing chamber, an opposite electrode having a plurality of uniform edges in order to get electric field be formed uniformly on the surface of the electrode, a high voltage applying unit applying the high voltage to the electrode, a gas providing unit providing monomer gas and non-monomer gas inside of the polymerizing chamber, and a pumping unit keeping vacuum inside of the chamber. The present invention can keep the uniformity of the electrode, accordingly the high quality polymerizing film can be fabricated by keeping the uniformity of the current density, carbonation on the each part of the electrode.

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Changwon, South Korea

Dong-Sik Youn