Lg Chem, Ltd

Dong-Sik Kim

Cheol-Hee Park

Dae Ki Lee

Jae-Ki Lee

Byung-Kyu Lim

Hyun-Woo Choi

Ye-Rok Park

Dae-Ki Lee

Seung-Hyup Lee

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

Metal paste and thermoelectric module

The present disclosure discloses a thermoelectric module to which a bonding technique for stably driving the thermoelectric module at high temperatures is applied and a method of manufacturing the thermoelectric module. The thermoelectric module according to the present disclosure includes thermoelectric elements including a thermoelectric semiconductor, an electrode which includes a metal material and is connected between the thermoelectric elements, and a bonding layer which is interposed between the thermoelectric element and the electrode to bond the thermoelectric element with the electrode and includes a metal compound including metals of two or more classes as a sintered body of a paste including metal powders of two or more classes.

Thermoelectric module and manufacturing method thereof

Growing community of inventors

Daejeon, South Korea

Dong-Sik Kim