Samsung Electronics Co., Ltd.

Dong Sik Jeong

Yong Hee Lee

Sun Ho Kim

Seung Uk Park

Woo-Hyung Kim

Kyung Chin Yi

Provided is a lithography apparatus including a wafer stage, a cable connected to the wafer stage, the cable being configured to bend based on the wafer stage moving, a support unit configured to prevent the cable from sagging, the support unit including a plurality of clamps configured to restrict movement of the cable and a connection member connecting the plurality of clamps to each other, and a protective unit under the cable, the protective unit being configured to collide with the support unit based on the wafer stage moving, wherein the protective unit includes ultra-high molecular weight polyethylene (UHMWPE).

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Suwon-si, South Korea

Dong Sik Jeong