Cheil Industries Inc.

Cheil Industrial, Inc.

Dong Seon Uh

Jong Seob Kim

Jin Kuk Lee

Chang Il Oh

Hui Chan Yun

Jin Seong Park

Do Hyeon Kim

Kyong Ho Yoon

Min Soo Kim

Irina Nam

Kyoung Soo Park

Jae Sun Han

Young Woo Park

Jin Kyu Kim

Arum Yu

Kwang Jin Jung

Hyun Min Choi

Youn Jo Ko

Jang Hyun Cho

Kyung Hee Hyung

Kyung Il Sul

Nam Ju Kim

Hyun Hee Namkung

Sang Sik Bae

Joon Mo Seo

Hwan Sung Cheon

Jin Young Seo

Hyun Wook Kim

Mi Young Kim

Sang Jo Lim

Sang Kyun Kim

Hyun Hoo Sung

Sang Ran Koh

Kyung Jin Lee

Gyu Ho Lee

Woo Jin Lee

Sang-Kyun Kim

Jin Ho Bae

Chang Soo Woo

Jong-Seob Kim

Young Hoon Kim

Tae Hyun Lee

Ja Young Hwang

Baek Soung Park

Hyoun Young Kim

In Hwan Kim

Ki Tae Song

Woo Jun Lim

Jeong Ku Kang

Chang Se Woo

Bong Yong Kim

Young Hun Kim

Kil Yong Lee

Nataliya Tokareva

Sang Hak Lim

Jin Hee Bae

Il Rae Cho

An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160&#xb0; C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.

Electronic device

A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/&#xb0; C. or less at about 100&#xb0; C. or less.

Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

Anisotropic conductive film and semiconductor device bonded by the same

An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1:Connection resistance increment (%)=|()/|&#xd7;100&#x2003;&#x2003;(Expression 1)where A is a connection resistance measured after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85&#xb0; C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.

An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, where, in Formula 1, Rmay be selected from the group of hydrogen, C-Calkyl, C-Caryl, &#x2014;C(&#x2550;O)R, &#x2014;C(&#x2550;O)OR, and &#x2014;C(&#x2550;O)NHR(in which R, R, and Rmay each independently be selected from C-Calkyl and C-Caryl), Rmay be C-Calkyl, and Rmay be selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, a benzyl group, a C-Calkyl-substituted benzyl group, and a naphthylmethyl group.

Electronic device using anisotropic conductive composition and film

An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.

Optical member comprising anisotropic conductive film

An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, wherein the anisotropic conductive film has an electrical conductivity of more than 0 &#x3bc;S/cm to about 100 &#x3bc;S/cm.

Anisotropic conductive film, composition for the same, and apparatus including the same

An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the anisotropic conductive film has a halogen ion content of more than 0 ppm to about 100 ppm.

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.

Anisotropic conductive film and semiconductor device

An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa&#xb7;s to about 10,000 Pa&#xb7;s at about 30&#xb0; C. to about 200&#xb0; C.

Anisotropic conductive film and apparatus including the same

An adhesive composition for a semiconductor has two exothermic peaks between 65&#xb0; C. and 350&#xb0; C. and has an area ratio of voids of less than 10%, measured after curing at 150&#xb0; C. for 10 minutes and then at 150&#xb0; C. for 30 minutes, and then molding at 175&#xb0; C. for 60 seconds. A first exothermic peak appears between 65&#xb0; C. and 185&#xb0; C. and a second exothermic peak appears between 155&#xb0; C. and 350&#xb0; C.

Adhesive composition for semiconductor and adhesive film comprising the same

An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.

Anisotropic conductive film and electronic device including the same

An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.

Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same

A hardmask composition for processing a resist underlayer film includes a solvent and an organosilane polymer, wherein the organosilane polymer is represented by Formula 6:  In Formula 6, R is methyl or ethyl, R' is substituted or unsubstituted cyclic or acyclic alkyl, Ar is an aromatic ring-containing functional group, x, y and z satisfy the relations x+y=4, 0.4&#x2266;x&#x2266;4, 0&#x2266;y&#x2266;3.6, and 4&#xd7;10&#x2266;z&#x2266;1, and n is from about 3 to about 500.

Hardmask composition and associated methods

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

Semiconductor device bonded by an anisotropic conductive film

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Seoul, South Korea

Dong Seon Uh