Industrial Technology Research Institute

Dong-Sen Chen

Chyi-Ming Leu

Yu-Yang Chang

Liang-You Jiang

Yu-Ju Kuo

Chun-Wei Su

Chih-Jen Yang

Hsiao-Fen Wei

Li-Ting Huang

Yung-Lung Tseng

Janglin Chen

A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein Aand Aare independently tetravalent moiety; Ais a divalent moiety; n&#x2265;1; m&#x2265;1; Ris independently hydrogen, Calkyl, Cfluoroalkyl, Calkoxy, or Caryl; and Ris independently hydrogen, Calkyl, Cfluoroalkyl, Calkoxy, Caryl, or a reactive functional group.

Polymer, composition, and polysiloxane-polyimide material thereof

A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.

Polyimide hybrid material, precursor solution and manufacture method thereof

An optical waveguide includes a lower clad layer, a core layer, and an upper clad layer, wherein the core layer is disposed between the lower clad layer and the upper clad layer. The lower clad layer has a composition including unetchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a composition including etchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The upper clad layer has a composition including an organic material and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a refractive index lager than that of the upper clad layer and the lower clad layer.

Optical waveguide and method for manufacturing the same

Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

Method for isolating flexible film from support substrate

A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.

Growing community of inventors

Zhudong, Taiwan

Dong-Sen Chen