Adlink Technology Inc.

Dong-Rui Chan

Min-Lun Huang

Juang-Shin Chen

A circuit board structure for mobile PCI express module is applied to conform to PCI Express 4.0 specification. The circuit board structure includes a top signal layer and a bottom signal layer with a core and a conductive copper wire, a power supply layer disposed between the top signal layer and the bottom signal layer, a plurality of first insulating layers disposed between the top signal layer and the power supply layer and between the bottom signal layer and the power supply layer, and a plurality of second insulating layers disposed between the power supply layer and the first insulating layers. The dielectric loss values of the first insulating layer and the second insulating layer are between 0.004 and 0.014, and the length of the conductive cooper wire is between 500 and 2500 mil, so that the signal loss of the mobile PCI express module is less than 8 dB.

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Taoyuan, Taiwan

Dong-Rui Chan