Fukui Precision Component (shenzhen) Co., Ltd.

Zhen Ding Technology Co., Ltd.

Foxconn Advanced Technology Inc.

Dong-Qing He

Ming Wang

Cheng-Hsien Lin

Wen-Chin Lee

Chih-Yi Tu

Yun-Li Zhu

Xiao-Hong Zhang

A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.

Flexible printed circuit board having curved edge

The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.

Printed circuit boards

A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.

Method for manufacturing printed circuit board having different thicknesses in different areas

Growing community of inventors

Shenzhen, China

Dong-Qing He