Electronics and Telecommunications Research Institute

Lg Chem, Ltd

Dong Pyo Kim

Kyu Ha Baek

Lee Mi Do

Kun Sik Park

Ji Man Park

Chong Kyu Shin

Joo Yeon Kim

Jin-Yeong Kang

Yong Su Park

Zin Sig Kim

Jung Hye Won

Ye Sul Jeong

Yong Hyun Ham

Lan Young Hong

Jong Chang Woo

An RFID tag includes: an antenna receiving an RF signal from a reader; an AFE (analog front end) generating voltage using the RF signal; and one or more switches interposed between the antenna and the AFE and controlling the connection between the antenna and the AFE through the switch operation.

RFID tag

Provided are a backlight unit capable of improving light efficiency and acquiring a high-luminance image by implementing a color image without using a color filter having the large light loss and a liquid crystal display including the same. The backlight unit includes: a white light source generating white light, a light guide plate into which the white light is inputted, a blue phosphor sheet formed above the light guide plate and transmitting the white light, and a multi-color phosphor sheet formed on the same plane above the blue phosphor sheet and including a plurality of red phosphor layers, green phosphor layers, and transparent layers which transmit the light transmitted through the blue phosphor sheet.

Backlight unit and liquid crystal display including the same

An organic light emitting diode (OLED) and a method for manufacturing the same are provided. In the OLED, patterned metal electrodes are positioned on one or more of upper and lower portions of a light emission layer to allow light generated from the light emission layer to emit to an area between the patterned metal electrodes.

Organic light emitting diode and manufacturing method thereof

A via forming method that includes forming via-holes in a substrate is provided. The method includes putting the substrate, having the via-holes, in a first solution to fill the via-holes with the first solution. Metal particles are sunk into the via-holes by supplying a second solution containing the metal particles to the first solution. A first curing process of heat-treating the substrate is performed so as to form vias in the via-holes. A multi-chip package that includes the substrate having the vias is also provided.

Via forming method and method of manufacturing multi-chip package using the same

Disclosed is an adjuvant capable of imparting a hydrophilic or superhydrophilic function to various materials or interfaces. The hydrophilic adjuvant comprises: a composite metal oxide containing Si and at least one metal element selected from the group consisting of Ti(IV), Zr(IV), Sn(IV) and Al(III); and a hydrophilic group-containing organic compound physically or chemically bonded with the Ti(IV), Zr(IV), Sn(IV) or Al of the composite metal oxide.

Hydrophilic adjuvant

Growing community of inventors

Gwangmyeong, South Korea

Dong Pyo Kim