Micron Technology Incorporated

Nan Ya Technology Corporation

Dong Pan

Wei Lu Chu

Zhi Qi Huang

Yu Zhang

Timothy B Cowles

Paul A Silvestri

Ming H Li

John David Porter

Jeffrey P Wright

Feng Lin

Jun Wu

Abhay S Dixit

Yuanzhong Wan

Liang Li

Greg A Blodgett

Yantao Ma

Hiromasa Noda

Liang Liu

Leel S Janzen

Beau D Barry

Feng (Dan) Lin

Zhiqi Huang

Weilu Chu

Xinyu Wu

Yuan He

John Frederic Schreck

Scott D Van De Graaff

Fei Xu

Subhasis Sasmal

Yuan Zhong Wan

Suresh Chattu

Systems and methods described herein may increase voltages sensed during testing of a device-under-test, which may increase an ease of sensing by a comparator, where a relatively less sensitive comparator may be used to detect the increased voltage sensed. Indeed, readout circuitry may include two or more diodes coupled in series to a resistor, which may help increase the voltages sensed via the readout circuitry.

Multiple diode reference readout circuitry of a degradation sensing circuit

Counters may be provided for individual word lines of a memory for tracking word line accesses. In some examples, multiple counters may be provided for individual word lines. In some examples, the counters may be included on the word lines. The counters may be incremented responsive to word line accesses in some examples. In some examples, the counters may be incremented responsive for a time period for which a word line is held open. In some examples, the counters may be incremented responsive to both word line accesses and time periods for which the word line is held open. In some examples, count values for the counters may be written back to the counters after incrementing. In some examples, the count values may be written back prior to receiving a precharge command.

Apparatuses and methods for tracking word line accesses

Apparatuses and methods for row hammer counter mat. A memory array may have a number of memory mats and a counter memory mat. The counter mat stores count values, each of which is associated with a row in one of the other memory mats. When a row is accessed, the count value is read out, changed, and written back to the counter mat. In some embodiments, the count value may be processed within access logic of the counter mat, and a row hammer flag may be provided to the bank logic. In some embodiments, the counter mat may have a folded architecture where each sense amplifier is coupled to multiple bit lines in the counter mat. The count value may be used to determine if the accessed row is an aggressor so that its victims can be refreshed as part of a targeted refresh.

Apparatuses and methods for row hammer counter mat

Systems and devices are provided for tracking bandgap current generated by a bandgap circuit and mitigation of leakage current regardless of variations in PVT conditions. An apparatus may include one or more power amplifiers that powers components of the apparatus and comprising a transistor. The apparatus may also include bandgap current mirroring circuitry that generates a mirrored current that mirrors a received current that is process, voltage, and temperature (PVT) independent. The apparatus may also include a bulk voltage generator circuit including an amplifier having an input coupled to the bandgap current mirroring circuitry. Bulk voltage control circuitry is coupled to an output of the amplifier and generates a bulk voltage based on the relationship between the mirrored current and the leakage current.

Current tracking bulk voltage generator

An electronic device, such as a memory device, may include various circuit components. The electronic device may also include one or more voltage testing circuits to determine whether signals of one or more of the circuit components are within acceptable voltage ranges of the respective circuit components. Systems and methods are described to improve correct voltage measurement of the received signals by a voltage testing circuit. In particular, multiple supply voltage levels are provided to different components of the voltage testing circuit to provide a sufficient headroom voltage gap between received signals and the supply voltages. For example, some active circuits (e.g., operational amplifiers) of the voltage testing circuit may receive a higher supply voltage of the electronic device compared to one or more other circuits of the voltage testing circuit.

Voltage testing circuit with error protection scheme

A device includes source circuitry comprising a first portion of a current mirror and a first transistor. The device also includes load circuitry comprising a second portion of the current mirror and a second transistor, wherein the load circuitry is disposed at a distance from the source circuitry. The device further includes a path coupled to a first gate of the first transistor and to a second gate of the second transistor, wherein the path provides a predetermined voltage to both of the first gate of the first transistor and to the second gate of the second transistor.

Systems for reducing inconsistencies across current mirror

Methods and apparatuses are provided for temperature independent resistive-capacitive delay circuits of a semiconductor device. For example, delays associated with ZQ calibration or timing of the RAS chain may be implemented that to include circuitry that exhibits both proportional to absolute temperature (PTAT) characteristics and complementary to absolute temperature (CTAT) characteristics in order to control delay times across a range of operating temperatures. The RC delay circuits may include a first type of circuitry having impedance with PTAT characteristics that is coupled to an output node in parallel with a second type of circuitry having impedance with CTAT characteristics. The first type of circuitry may include a resistor and the second type of circuitry may include a transistor, in some embodiments.

Methods and apparatuses for temperature independent delay circuitry

A semiconductor device may include a bandgap circuit that outputs a reference voltage. The bandgap circuit may include a bandgap core circuit and a startup circuit coupled to the bandgap core circuit. The startup circuit may connect a voltage source to a node that corresponds to an output of the bandgap core circuit in response to the bandgap core circuit being initialized. The startup circuit may also disconnect the voltage source from the node in response to the output voltage being equal to or greater than a desired voltage (e.g., a threshold voltage) and one or more local voltages of the bandgap core circuit being equal to or greater than a local threshold voltage.

Systems and methods for initializing bandgap circuits

A multi-mode voltage pump may be configured to select an operational mode based on a temperature of a semiconductor device. The selected mode for a range of temperature values may be determined based on process variations and operational differences caused by temperature changes. The different selected modes of operation of the multi-mode voltage pump may provide pumped voltage having different voltage magnitudes. For example, the multi-mode voltage pump may operate in a first mode that uses two stages to provide a first VPP voltage, a second mode that uses a single stage to provide a second VPP voltage, or a third mode that uses a mixture of a single stage and two stages to provide a third VPP voltage. The third VPP voltage may be between the first and second VPP voltages, with the first VPP voltage having the greatest magnitude. Control signal timing of circuitry of the multi-mode voltage pump may be based on an oscillator signal.

Multi-mode voltage pump and control

A temperature sensor is disclosed. The temperature sensor includes an analog core having at least first and second circuit nodes and configured to provide a temperature dependent output, a multiplexer coupled to the first and second circuit nodes and configured for at least first and second states in each of which the first circuit node couples to a different circuit element and in each of which the second circuit node couples to a different circuit element, and a controller coupled to the analog core and configured to provide a temperature measurement that is an average of at least first and second readings of the temperature dependent output of the analog core, the first reading taken while the multiplexer is in the first state, and the second reading taken while the multiplexer is in the second state.

Systems and methods for reducing temperature sensor reading variation due to device mismatch

Apparatuses, systems, and methods for refresh modes. A memory may need to perform targeted refresh operations to refresh the 'victim' word lines which are near to frequently accessed 'aggressor' word lines. To refresh the victims at a high enough rate, it may be desirable to refresh multiple victims as part of the same refresh operation. However, certain word lines (e.g., word lines in a same section or adjacent sections of the memory) cannot be refreshed together. The memory may have a section comparator, which may check stored aggressor addresses and may provide a signal if there are not two stored addresses which can be refreshed together. Based, in part, on the signal, the memory may activate one of several different refresh modes, which may control the types of refresh operation performed responsive to a refresh signal.

Refresh modes for performing various refresh operation types

Methods, systems, and devices for compensating for kickback noise are described. A regulator may include an input circuit, a bias circuit, and an enable circuit. The regulator may be configured so that the enable circuit is positioned between the input circuit and the bias circuit. A balance resistor may be included in a path between an input of the regulator and a gate of a bias transistor included in the bias transistor. A size of the balance resistor may be based on an amount of charge drawn by the bias transistor during an activation event. Dimensions of the bias transistor may be modified based on an amount of charge drawn by the bias transistor during an activation event.

Memory system capable of compensating for kickback noise

Methods, systems, and devices for operating an amplifier with a controllable pull-down capability are described. A memory device may include a memory array and a power circuit that generates an internal signal for components in the memory array. The power circuit may include an amplifier and a power transistor that is coupled with the amplifier. A pull-down capability of the amplifier may be controllable using an external signal that is based on a difference between a reference signal and the internal signal. The power circuit may also include a comparator that is coupled with the amplifier and configured to compare the reference signal and the internal signal. Components of the comparator may be integrated with components of the amplifier, may share a bias circuit, and may use nodes within the amplifier to control the comparator. A signal output by the comparator may control the pull-down capability of the amplifier.

Amplifier with a controllable pull-down capability for a memory device

Apparatuses and methods for pure-time, self-adopt sampling for RHR refresh. An example apparatus includes a memory bank comprising a plurality of rows each associated with a respective row address, and a sampling timing generator circuit configured to provide a timing signal having a plurality of pulses. Each of the plurality of pulses is configured to initiate sampling of a respective row address associated with a row of the plurality of rows to detect a row hammer attack. The sampling timing generator includes first circuitry configured to provide a first subset of pulses of the plurality of pulses during a first time period and includes second circuitry configured to initiate provision of a second subset of pulses of the plurality of pulses during a second time period after the first time period.

Apparatuses and methods for pure-time, self adopt sampling for row hammer refresh sampling

Methods, systems, and devices for timing signal delay compensation in a memory device are described. In some memory devices, operations for accessing memory cells may be performed with timing that is asynchronous relative to an input signal. To support asynchronous timing, a memory device may include delay components that support generating a timing signal having aspects that are delayed relative to an input signal. In accordance with examples as disclosed herein, a memory device may include delay components having a variable and configurable impedance, where the configurable impedance may be based at least in part on a configuration signal generated at the memory device. A configuration signal may be generated based on fabrication characteristics of the memory device, or based on operating conditions of the memory device, or various combinations thereof.

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Boise, ID, United States of America

Dong Pan