Xilinx, Inc.

Google Inc.

Verizon Patent and Licensing Inc.

Dong P Kim

Arifur Rahman

Johannes P Schmidt

Kumar Nagarajan

Henley Liu

Paul Y Wu

Namhoon Kim

Myongseob Kim

Cheang-Whang Chang

Ji Heun Lee

Kong Weng Lee

S Gabriel R Dosdos

Vivian Tan Lum

Content streams, such as video streams, may be seamlessly provided as both multicast and unicast transmissions. For example, in one implementation, a mobile device may receive a request, from a user of the mobile device, to play streaming content at the mobile device. The mobile device may receive, from a wireless network, and using multicast techniques, a sequence of content segments that correspond to the requested streaming content, and determine when a content segment is missing from the sequence of content segments. The mobile device may request, in response to the determination of the missing content segment, the missing content segment, from the wireless network, using unicast techniques; and insert the received missing content segment into the sequence of content segments to obtain the sequence of content segments as a sequence that includes content segments received using both multicast and unicast techniques.

Seamless multicast and unicast switching for content playback

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for verifying the ability of a processing system to crawl and index a native application and links for provided for the native application, and to make available reporting data that details the results of one or more verification tests.

Verification of native applications for indexing

A method for testing TSVs is provided. A plurality of TSVs is formed in a semiconductor substrate. Wiring layers and a first contact array are formed on the front-side of the substrate. The wiring layers couple each of the TSVs to a respective contact of the first contact array. Conductive adhesive is deposited over the first contact array. The conductive adhesive electrically couples contacts of the first contact array. A carrier is bonded to the front-side of the substrate with the conductive adhesive. After bonding the carrier to the substrate, the back-side of the substrate is thinned to expose each of the TSVs on the back-side of the substrate. A second contact array is formed, having a contact coupled to each respective TSV. Conductivity and connections of the TSVs, wiring layers, and contacts are tested by testing for conductivity between contacts of the second contact array.

Methods of manufacturing a semiconductor structure

A silicon substrate has a conductive via extending from a first surface of the silicon substrate through the silicon substrate to a second surface of the silicon substrate. A dielectric via extends from the second surface of the silicon substrate toward the first surface of the silicon substrate.

Air through-silicon via structure

An integrated circuit package assembly includes a substrate, a semiconductor die having opposing first and second surfaces, and a head-spreader. The semiconductor die is mounted on the substrate with the first surface facing the substrate. The heat-spreader includes a central region thermally coupled to the second surface of the semiconductor die, a flange region mounted on the substrate, and a side wall region between the central and flange regions. A cavity is formed between the heat-spreader, the substrate, and the semiconductor die. The heat-spreader has at least one vent extending from the cavity through the heat-spreader.

Integrated circuit assembly having vented heat-spreader

Growing community of inventors

San Jose, CA, United States of America

Dong P Kim